Mold Process Dev Engineer for Advanced Packaging

Nexperia Germany; Seremban; On-site; MYR 61,000 - 100,000; Full time

Job summary

Nexperia is seeking a Mold Process Development Engineer in Malaysia to drive development, characterization, and industrialization of molding technologies for semiconductor packages. You will enable new package platforms, improve robustness, and support the technology roadmap with innovative solutions and leadership.

You will work with cross-functional and global teams to deliver reliable, manufacturable, and cost-effective package solutions meeting customer and business requirements.

Qualifications

• Bachelor's degree in Engineering or a related technical discipline.
• 1-2 years of experience in a manufacturing environment, preferably within the semiconductor industry.
• Hands-on experience in molding backend assembly processes.

Responsibilities

• Develop and characterize for new process technology.
• Ensure technical communication and information flow within the project team and guide technical discussions on molding topics.
• Conduct competitor benchmarking and technology studies to input on package roadmap.
• Provide technical input for assembly process/equipment solutions for assigned new products or platform.
• Understand process integration risk and develop a risk mitigation plan.
• Provide technical solutions from development to establish robust package manufacturability and reliability.
• Provide technical support on molding for internal and external customers.
• Demonstrate technical leadership and drive process challenges with cross-site members.

Skills

Molding processes

DOE

SPC

FMEA

Education

Bachelor's degree in Engineering

Tools

Minitab

Job description

Nexperia is seeking a Mold Process Development Engineer in Malaysia to drive development, characterization, and industrialization of molding technologies for semiconductor packages. You will enable new package platforms, improve robustness, and support the technology roadmap with innovative solutions and leadership.

You will work with cross-functional and global teams to deliver reliable, manufacturable, and cost-effective package solutions meeting customer and business requirements.