Mold Process Engineer (Operation & Sustaining)

MVC Resources; Malacca City; On-site; MYR 60,000 - 96,000; Full time

Job summary

MVC Resources seeks a hands-on Mold Process Engineer in Melaka to support high-volume molding lines in a leading semiconductor packaging facility.

You will optimize processes, reduce downtime, and drive defect elimination by controlling EMC rheology and using SPC/DOE/8D/FMEA methodologies to improve yield and reliability.

Qualifications

• Bachelor’s degree in Mechanical, Chemical, Materials Science, or Electronics Engineering is required.
• 4–8 years of hands-on semiconductor manufacturing experience in encapsulation and molding is required.
• Strong knowledge of Epoxy Molding Compound (EMC) properties and operation of molding equipment.
• Proficiency with SPC, DOE, 8D problem solving, and FMEA is expected.

Responsibilities

• Provide daily line-sustaining and defect-resolution support for high-volume molding lines.
• Troubleshoot and eliminate defects such as voiding, warpage, flash, wire sweep, and delamination.
• Manage EMC parameters, flow, gel time, rheology, pre-heating, and curing profiles.

Skills

SPC

DOE

8D

FMEA

Mold machinery

Education

Bachelor’s Degree in Mechanical Engineering

Tools

Towa systems

ASM systems

Fico systems

Job description

Company Overview

Our client is a Global Semiconductor Pioneer & World Leader in High-Performance Analog, Mixed-Signal & Integrated Power Processing Technologies. The Melaka manufacturing site serves as a key global hub for high-reliability back-end packaging, assembly, and testing. To maintain zero-defect output, maximize yield, and maintain automated encapsulation systems, the Process Engineering department is seeking a hands-on Mold Process Engineer.

Position Overview

Reporting to the Mold Section Manager, the Mold Process Engineer provides daily line-sustaining, process optimization, and defect-elimination support across automated molding lines. This operational engineering role focuses on managing Epoxy Molding Compound (EMC) rheology, minimizing machine downtime, and driving root-cause defect elimination across auto-molding systems.

Key Responsibilities

1. Daily Line-Sustaining & Defect Resolution

• Provide daily process engineering support for high-volume transfer and compression molding production lines.
• Troubleshoot, contain, and eliminate critical molding defects—including voiding, package warpage, compound flash/bleeding, wire sweep, and package delamination.
• Manage Epoxy Molding Compound (EMC) parameters, evaluating compound flow, gel time, resin rheology, pellet pre-heating, and curing profiles.

2. Automated System Optimization & Yield Enhancement

• Maintain and optimize automated transfer and compression molding platforms (e.g., Towa, ASM, Fico systems).
• Apply Statistical Process Control (SPC), Design of Experiments (DOE), and 8D Root Cause Analysis to drive process stability, Cpk improvements, and yield enhancement.
• Qualify new EMC materials, mold chase designs, and release agents for new package conversions.

Requirements

• Education: Bachelor’s Degree in Mechanical, Chemical, Materials Science, or Electronics Engineering.
• Work Experience: 4 to 8 years of hands-on semiconductor manufacturing experience specializing in encapsulation and molding processes.
• Domain Expertise: In-depth technical knowledge of Epoxy Molding Compound (EMC) properties and hands-on operation/troubleshooting of automated molding machinery (Towa, ASM, or Fico platforms).
• Methodologies: Strong proficiency in SPC, DOE, 8D problem-solving, and FMEA frameworks.