Mold Process Dev Engineer for Advanced Semiconductors

Nexperia; Seremban; On-site; MYR 90,000 - 140,000; Full time

Job summary

Nexperia in Malaysia (Seremban) is seeking a Mold Process Development Engineer to drive development, characterization, and industrialization of molding technologies for advanced semiconductor packages.

You will work with global teams to deliver reliable, manufacturable, and cost-efficient package solutions, applying DOE, FMEA, and statistical methods to improve process robustness and yield while supporting the technology roadmap.

Qualifications

• Bachelor's degree in Engineering or related technical discipline.
• 1–2 years of manufacturing experience in semiconductors.
• Hands-on molding backend assembly experience.
• Familiarity with DOE, FMEA, and statistical methods.

Responsibilities

• Develop and characterize new molding process technology and ensure technical communication within the project team.
• Provide technical input for assembly process solutions for new products.
• Identify process risks and implement mitigation plans.
• Provide technical support on molding for internal and external customers.
• Lead technical discussions and collaborate across sites.

Skills

Molding processes

DOE

FMEA

Statistical analysis

Six Sigma

Education

Bachelor's Degree in Engineering

Tools

Minitab

Job description

Nexperia in Malaysia (Seremban) is seeking a Mold Process Development Engineer to drive development, characterization, and industrialization of molding technologies for advanced semiconductor packages.

You will work with global teams to deliver reliable, manufacturable, and cost-efficient package solutions, applying DOE, FMEA, and statistical methods to improve process robustness and yield while supporting the technology roadmap.