Mold Process Development Engineer

Nexperia Germany; Seremban; On-site; MYR 61,000 - 100,000; Full time

Job summary

Nexperia is seeking a Mold Process Development Engineer in Malaysia to drive development, characterization, and industrialization of molding technologies for semiconductor packages. You will enable new package platforms, improve robustness, and support the technology roadmap with innovative solutions and leadership.

You will work with cross-functional and global teams to deliver reliable, manufacturable, and cost-effective package solutions meeting customer and business requirements.

Qualifications

• Bachelor's degree in Engineering or a related technical discipline.
• 1-2 years of experience in a manufacturing environment, preferably within the semiconductor industry.
• Hands-on experience in molding backend assembly processes.

Responsibilities

• Develop and characterize for new process technology.
• Ensure technical communication and information flow within the project team and guide technical discussions on molding topics.
• Conduct competitor benchmarking and technology studies to input on package roadmap.
• Provide technical input for assembly process/equipment solutions for assigned new products or platform.
• Understand process integration risk and develop a risk mitigation plan.
• Provide technical solutions from development to establish robust package manufacturability and reliability.
• Provide technical support on molding for internal and external customers.
• Demonstrate technical leadership and drive process challenges with cross-site members.

Skills

Molding processes

DOE

SPC

FMEA

Education

Bachelor's degree in Engineering

Tools

Minitab

Job description

About the Role

As a Mold Process Development Engineer , you will be responsible for driving the development, characterization, and industrialization of advanced molding technologies for semiconductor packages. You will play a critical role in enabling new package platforms, improving process robustness, and supporting Nexperia's technology roadmap through innovative process solutions and technical leadership. Working closely with cross-functional and global teams, you will contribute to delivering reliable, manufacturable, and cost-effective package solutions that meet customer and business requirements.

What Will You Do?

• Develop and characterize for new process technology.
• Responsible to ensure technical communication and information flow within the project team and guiding technical discussions on Molding topics. Experience with other EOL processes is advantageous.
• Conduct competitor benchmarking and technology studies to input on Nexperia package roadmap.
• Technical input for assembly process / equipment solutions for assigned new products or platform.
• Understand the process integration risk and come out with a risk mitigation plan.
• Provide technical solution starting from development to establish robust package manufacturability and reliability.
• Provide technical support on molding for both internal and external customer.
• Demonstrate technical leadership in subject matter and drive process challenges with cross site members.

What Will You Need?

Qualifications & Experience

• Bachelor's Degree in Engineering or a related technical discipline.
• 1-2 years of experience in a manufacturing environment, preferably within the semiconductor industry.
• Hands-on experience in molding backend assembly processes.
• Experience with wire-bonded and clip-bonded package technologies is preferred.
• Exposure to other End-of-Line (EOL) assembly processes will be an added advantage.
• Familiarity with process development methodologies, including Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and statistical analysis techniques.

Technical Competencies

• Strong knowledge of semiconductor assembly and molding processes.
• Proficient in statistical analysis and quality improvement methodologies, including: DOE (Design of Experiments) SPC (Statistical Process Control) FMEA (Failure Mode and Effects Analysis) 8D Problem Solving Minitab or equivalent statistical software
• Knowledge of Six Sigma principles and process optimization techniques.
• Strong analytical and troubleshooting skills with a structured approach to problem-solving.
• Ability to identify process risks and develop effective mitigation strategies.

Soft Skills

• Excellent communication skills with strong written and verbal proficiency in English.
• Strong interpersonal skills with the ability to collaborate effectively across diverse teams and functions.
• Demonstrated leadership potential with the ability to influence and drive technical discussions.
• Highly motivated, proactive, and customer-focused with a sense of urgency in resolving issues.
• Strong teamwork, stakeholder management, and relationship-building capabilities.
• Ability to thrive in a dynamic, fast-paced development environment while managing multiple priorities.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.