MES Equipment Engineer - Wire Bond & Die Attach

Texas Instruments Electronics Malaysia Sdn Bhd; Kuala Lumpur; On-site; MYR 110,000 - 170,000; Full time

Job summary

Texas Instruments Electronics Malaysia Sdn Bhd is seeking a specialized Equipment Engineer to drive MES implementation on Wire Bond and Die Attach lines. A 1-month TI orientation leads into a 1-2 year MES project team, after which you transition to production to optimize uptime in a high-volume manufacturing environment.

The role requires hands-on semiconductor equipment experience, MES platform knowledge, and the ability to coordinate cross-functional teams; you'll contribute to continuous

Qualifications

• Minimum education: Bachelor's in engineering or physics or related field.
• 2+ years of hands-on semiconductor equipment experience in Wire Bond and/or Die Attach.
• Strong analytical and problem-solving abilities.

Responsibilities

• MES Implementation (Project Phase): Represent equipment engineering in the MES rollout and define workflows, setup/recipe controls, qualification requirements, and equipment states.
• Integration & Data: Translate shop-floor requirements into digital process designs and define data collection needs and interlocks.
• Validation: Validate equipment integration scenarios and lead UAT and production deployment.
• Sustaining (Post-Project): Transition to production to manage equipment reliability and drive continuous improvement.

Skills

Hands-on semiconductor equipment

Team collaboration

Effective communication

Problem solving

Education

Bachelor's degree in engineering or physics

Tools

MES platforms (Siemens OpCenter)

PAC integration awareness

Tool monitoring software

Job description

Texas Instruments Electronics Malaysia Sdn Bhd is seeking a specialized Equipment Engineer to drive MES implementation on Wire Bond and Die Attach lines. A 1-month TI orientation leads into a 1-2 year MES project team, after which you transition to production to optimize uptime in a high-volume manufacturing environment.

The role requires hands-on semiconductor equipment experience, MES platform knowledge, and the ability to coordinate cross-functional teams; you'll contribute to continuous