Senior Packaging Engineer Thermal Design for Small-Form PCBA

Sandisk; Batu Kawan; On-site; MYR 60,000 - 90,000; Full time

Job summary

Sandisk is seeking a Packaging Engineer to join the Packaging R&D group, focusing on thermal designs across semiconductor packaging level, flash product PCBA level, and host level. The role includes CFD-based thermal modeling and validation of flash products PCBA using analytical methods and measurements.

The ideal candidate should have a B.S. in Mechanical Engineering with 5 years of relevant experience, strong CAD skills (SolidWorks, AutoCAD), and knowledge of plastic injection molding and

Qualifications

• B.S. in Mechanical Engineering with 5 years of relevant industry experience.
• Solid knowledge in mechanical design.
• Proficiency in CAD software (SolidWorks, AutoCAD).
• Experience with plastic injection molding and metal fabrication.
• Ability to work in a team and meet schedules.
• Experience working with outside suppliers and contract manufacturers.

Responsibilities

• Work in Packaging R&D on thermal designs across packaging levels (thermal designs across semiconductor packaging level, PCBA level, and host level).
• Perform thermal modeling (CFD) and validation of flash products PCBA using analytical/ numerical analysis and measurement techniques.
• Develop solutions to meet demands for small form factor packages in constrained environments.

Skills

Strong communication

Team collaboration

Thermal design

CAD proficiency

Mechanical design

Education

B.S. in Mechanical Engineering

Tools

SolidWorks

AutoCAD

Job description

Sandisk is seeking a Packaging Engineer to join the Packaging R&D group, focusing on thermal designs across semiconductor packaging level, flash product PCBA level, and host level. The role includes CFD-based thermal modeling and validation of flash products PCBA using analytical methods and measurements.

The ideal candidate should have a B.S. in Mechanical Engineering with 5 years of relevant experience, strong CAD skills (SolidWorks, AutoCAD), and knowledge of plastic injection molding and