Global Head of FOL & EOL Engineering

Private Advertiser; Perak; On-site; MYR 350,000 - 550,000; Full time

Job summary

Private Advertiser based in Ipoh seeks a Head of FOL & EOL Engineering to lead and unify the FOL and EOL teams across process, equipment, and integration disciplines. You will shape strategy, drive process improvements, and partner with operations to enable scalable, high-volume production.

The role requires 15-20 years in semiconductor manufacturing with 8-10 years in engineering leadership, strong backend assembly, FOL/EOL, and packaging expertise, and a proven track record in multi-site

Qualifications

• 15-20 years of semiconductor manufacturing experience.
• Minimum 8-10 years in engineering leadership or senior management roles.
• Strong experience in semiconductor backend assembly engineering.
• FOL & EOL process engineering experience.
• Experience with advanced packaging technologies.
• Experience in high-volume manufacturing environments.

Responsibilities

• Lead and manage the FOL & EOL engineering organization including process, equipment, and integration engineering teams.
• Define and execute engineering strategies aligned with business goals and customer requirements.
• Build and strengthen engineering capabilities to support scalable manufacturing operations.
• Drive optimization and continuous improvement of FOL and EOL assembly processes.
• Lead implementation of advanced packaging technologies and process innovations.
• Ensure robust process control, capability, and repeatability in high-volume production.
• Provide engineering leadership to support high-mix, high-volume manufacturing operations.
• Ensure engineering readiness for NPI, transfers, and production ramps.
• Partner with operations to resolve technical issues and improve yield, cycle time, and efficiency.
• Collaborate with test engineering, operations, quality, and supply chain teams.
• Support DFM and DFT initiatives with customers and drive multi-site alignment.
• Act as a technical escalation point for global customers and assist in audits/reviews.
• Lead initiatives focused on yield improvement, defect reduction, and cost optimization.

Skills

Leadership

Semiconductor experience

Engineering management

Process engineering

Advanced packaging

High-volume manufacturing

Job description

Private Advertiser based in Ipoh seeks a Head of FOL & EOL Engineering to lead and unify the FOL and EOL teams across process, equipment, and integration disciplines. You will shape strategy, drive process improvements, and partner with operations to enable scalable, high-volume production.

The role requires 15-20 years in semiconductor manufacturing with 8-10 years in engineering leadership, strong backend assembly, FOL/EOL, and packaging expertise, and a proven track record in multi-site