Senior Engineer, NPI (Semiconductor Assembly & EOL)

Carsem; Ipoh; On-site; MYR 120,000 - 180,000; Full time

Job summary

Jora Malaysia is seeking a Senior Engineer to lead EOL/NPI activities in semiconductor assembly & EOL environments, ensuring timely project execution and cross-functional coordination.

You will review RFQ and TGA items, liaise with PM, QA, and production teams, and drive yield improvement through data-driven analyses and corrective actions. A strong engineering background in electronics is required.

Qualifications

• Bachelor's Degree in Engineering (Electrical, Electronics, Mechatronics, Manufacturing, Mechanical or related).
• Experience in semiconductor manufacturing, assembly, test, or NPI environment is an added advantage.

Responsibilities

• Review RFQ prepared by Project Management (PM) team – on EOL technical related item.
• Review TGA – on EOL related item.
• Attend con-call with customer and share project / action item updates.
• Liaise with internal cross functional department, supplier and customer on EOL related items.
• Support on EOL related item: BOM / Plan ID / Flow chart review and approval.
• Update Package packing spec and tool buyoff (Pick and Place / Laser Mark / Mold / etc).
• Support new product introduction (NPI), process transfer, and mass production
• Prepare Eng Validation and / or Qual report for NPI / newly develop package.
• Process monitoring and enhancement to ensure NPI / newly develop project meet yield target of min 98.5%.
• Work pro-actively with FOL NPI team / Package Development team / EOL Technician in order to ensure project run smoothly and released on time.
• Liaise with respective cross-functional groups: PM / Planner / QA / Prod / Process / Maintenance / Tooling department in order to ensure builds are completed on time.

Skills

EOL process knowledge

Data analysis

Failure analysis

Yield improvement

Statistical methods (SPC/DOE/FMEA/Six)

Education

Bachelor's Degree in Engineering

Tools

SPC software

DOE/FMEA tools

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Senior Engineer, NPI (Semiconductor Assembly & EOL)

Review RFQ prepared by Project Management (PM) team – on EOL technical related item.

Review TGA – on EOL related item.

Attend con-call with customer and share project / action item updates.

Liaise with internal cross functional department, supplier and customer on EOL related items.

Support on EOL related item:

• BOM / Plan ID / Flow chart review and approval.
• Update Package packing spec and tool buyoff (Pick and Place / Laser Mark / Mold / etc)

Support new product introduction (NPI), process transfer, and mass production

Prepare Eng Validation and / or Qual report for NPI / newly develop package.

Process monitoring and enhancement to ensure NPI / newly develop project meet yield target of min 98.5%.

Work pro-actively with FOL NPI team / Package Development team / EOL Technician in order to ensure project run smoothly and released on time.

Liaise with respective cross-functional groups: PM / Planner / QA / Prod / Process / Maintenance / Tooling department in order to ensure builds are completed on time.

TECHNICAL SKILLS & COMPETENCIES

DATA ANALYSIS & INTERPRETATION

EOL Process (Mold / Laser Mark / Singulation / Pick & Place) knowledge is an advantage

Data Collection, organization and interpretation data to support decision-making

FAILURE ANALYSIS & ROOT CAUSE INVESTIGATION

Ability to analyze product excursions and drive corrective actions.

Use of statistical tools (SPC, DOE, FMEA, Six Sigma).

YIELD & QUALITY IMPROVEMENT

Ramp-to-yield entitlement management.

Continuous improvement in cycle time, yield, and product quality.

REQUIREMENTS

Bachelor's Degree in Engineering (Electrical, Electronics, Mechatronics, Manufacturing, Mechanical, or related discipline).

Experience in semiconductor manufacturing, assembly, test, or NPI environment is an added advantage.