Head of FOL & EOL Engineering (Based in Ipoh)

Private Advertiser; Perak; On-site; MYR 350,000 - 550,000; Full time

Job summary

Private Advertiser based in Ipoh seeks a Head of FOL & EOL Engineering to lead and unify the FOL and EOL teams across process, equipment, and integration disciplines. You will shape strategy, drive process improvements, and partner with operations to enable scalable, high-volume production.

The role requires 15-20 years in semiconductor manufacturing with 8-10 years in engineering leadership, strong backend assembly, FOL/EOL, and packaging expertise, and a proven track record in multi-site

Qualifications

• 15-20 years of semiconductor manufacturing experience.
• Minimum 8-10 years in engineering leadership or senior management roles.
• Strong experience in semiconductor backend assembly engineering.
• FOL & EOL process engineering experience.
• Experience with advanced packaging technologies.
• Experience in high-volume manufacturing environments.

Responsibilities

• Lead and manage the FOL & EOL engineering organization including process, equipment, and integration engineering teams.
• Define and execute engineering strategies aligned with business goals and customer requirements.
• Build and strengthen engineering capabilities to support scalable manufacturing operations.
• Drive optimization and continuous improvement of FOL and EOL assembly processes.
• Lead implementation of advanced packaging technologies and process innovations.
• Ensure robust process control, capability, and repeatability in high-volume production.
• Provide engineering leadership to support high-mix, high-volume manufacturing operations.
• Ensure engineering readiness for NPI, transfers, and production ramps.
• Partner with operations to resolve technical issues and improve yield, cycle time, and efficiency.
• Collaborate with test engineering, operations, quality, and supply chain teams.
• Support DFM and DFT initiatives with customers and drive multi-site alignment.
• Act as a technical escalation point for global customers and assist in audits/reviews.
• Lead initiatives focused on yield improvement, defect reduction, and cost optimization.

Skills

Leadership

Semiconductor experience

Engineering management

Process engineering

Advanced packaging

High-volume manufacturing

Job description

Head of FOL & EOL Engineering (Based in Ipoh)

Lead and manage the FOL & EOL engineering organization, including process, equipment, and integration engineering teams

Define and execute engineering strategies aligned with business goals and customer requirements

Build and strengthen engineering capabilities to support scalable manufacturing operations

Process & Technology Development

Drive optimization and continuous improvement of FOL and EOL assembly processes

Lead implementation of advanced packaging technologies and process innovations

Ensure robust process control, capability, and repeatability in high-volume production

Manufacturing Support

Provide engineering leadership to support high-mix, high-volume manufacturing operations

Ensure engineering readiness for new product introduction (NPI), transfers, and production ramps

Partner with operations to resolve technical issues and improve yield, cycle time, and efficiency

Cross-Functional Collaboration

Collaborate closely with test engineering, operations, quality, and supply chain teams

Support design-for-manufacturability (DFM) and design-for-test (DFT) initiatives with customers

Drive alignment across multi-site or multi-line engineering operations

Customer Engineering Interface

Act as a technical escalation point for global customers

Ensure engineering alignment with customer specifications, quality standards, and timelines

Support customer audits, qualifications, and technical reviews

Lead initiatives focused on yield improvement, defect reduction, and cost optimization

Promote adoption of automation, digital engineering tools, and Industry 4.0 technologies

Drive data-driven decision-making and engineering excellence culture

Qualifications & Experience

Experience

15-20 years of semiconductor manufacturing experience

Minimum 8-10 years in engineering leadership or senior management roles

Strong experience in:

Semiconductor backend assembly engineering

FOL & EOL process engineering

Advanced packaging technologies

High-volume manufacturing environments

Leadership Experience

Proven track record managing:

Large engineering organizations

Cross-functional engineering teams

Multi-site or multi-line engineering operations

Your application will include the following questions:

• Which of the following statements best describes your right to work in Malaysia?
• What's your expected monthly basic salary?
• How many years' experience do you have in an Engineering Role?
• Which of the following types of qualifications do you have?