Senior Failure Analysis Engineer (Semiconductor Packaging)

NXP Semiconductors

Kuala Lumpur

On-site

MYR 90,000 - 120,000

Full time

14 days+
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Job summary

NXP Semiconductors Malaysia is seeking a specialist in FA sample preparation to support package‑level electrical FA and die‑level physical FA. The role requires hands‑on work with a broad range of FA techniques and a solid grounding in semiconductor processing and packaging.

You will contribute to developing new FA methods, participate in tool evaluation projects, and document results with clear conclusions and recommended actions. A relevant degree and 3+ years of experience are expected.

Qualifications

  • Bachelor’s or Master’s degree in Materials Science, Physics, Analytical Chemistry, or related field.
  • 3+ years in semiconductor manufacturing or R&D; Wafer Fab experience a plus.
  • Hands-on experience with FA sample preparation tools and techniques.
  • Strong theoretical and practical knowledge of semiconductor device processing and packaging technologies.

Responsibilities

  • Perform FA sample preparation using chemical processing, die extraction, polishing, and RIE.
  • Operate precision milling/polishing systems and RIE for site-specific sample prep.
  • Document analysis results with observations, conclusions, and corrective actions.
  • Contribute to development of new FA techniques, methodologies, and tool evaluation projects.

Skills

FA experience
Semiconductor knowledge
Packaging technologies knowledge

Education

Bachelor’s or Master’s in Materials Science/Physics/Analytical Chemistry

Job description

NXP Semiconductors Malaysia is seeking a specialist in FA sample preparation to support package‑level electrical FA and die‑level physical FA. The role requires hands‑on work with a broad range of FA techniques and a solid grounding in semiconductor processing and packaging.

You will contribute to developing new FA methods, participate in tool evaluation projects, and document results with clear conclusions and recommended actions. A relevant degree and 3+ years of experience are expected.

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