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NXP Semiconductors Malaysia is seeking a specialist in FA sample preparation to support package‑level electrical FA and die‑level physical FA. The role requires hands‑on work with a broad range of FA techniques and a solid grounding in semiconductor processing and packaging.
You will contribute to developing new FA methods, participate in tool evaluation projects, and document results with clear conclusions and recommended actions. A relevant degree and 3+ years of experience are expected.
NXP Semiconductors Malaysia is seeking a specialist in FA sample preparation to support package‑level electrical FA and die‑level physical FA. The role requires hands‑on work with a broad range of FA techniques and a solid grounding in semiconductor processing and packaging.
You will contribute to developing new FA methods, participate in tool evaluation projects, and document results with clear conclusions and recommended actions. A relevant degree and 3+ years of experience are expected.