Process Development Engineer: Die Attach & Flip Chip Packaging

1326 Analog Devices Manufacturing (Malaysia) Sdn. Bhd.; Penang; On-site; MYR 60,000 - 100,000; Full time

Job summary

Analog Devices in Penang seeks an experienced Semiconductor Packaging Engineer to develop, qualify, and optimize Die Attach and Flip Chip assembly processes for high-volume manufacturing. You will provide production support, perform DOE, and collaborate with equipment, materials, and product teams to drive yield, reliability, and process documentation while upholding quality standards.

The role emphasizes continuous improvement and transfer of processes from development to manufacturing with

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• 3–10 years of experience in semiconductor packaging or assembly manufacturing.
• Hands-on experience with Die Attach and Flip Chip processes in a production environment.
• Strong knowledge of die bonding techniques, flip chip assembly, underfill, and solder bump/micro-bump technology.
• Familiarity with reliability testing and failure analysis.

Responsibilities

• Develop, qualify, and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging.
• Provide process engineering support for production lines, including troubleshooting yield and quality issues.
• Perform DOE and process characterization to improve performance and reliability.
• Support new product introduction (NPI) and process transfer from development to high-volume manufacturing.
• Work closely with equipment, materials, and product engineering teams to resolve process-related issues.
• Establish and maintain process documentation, specifications, and control plans.
• Drive continuous improvement initiatives to enhance yield, productivity, and cycle time.
• Interface with equipment vendors and material suppliers to qualify new technologies and improvements.
• Ensure compliance with quality standards and manufacturing best practices.

Skills

Problem-solving

Cross-functional collaboration

Communication skills

Education

Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering

Tools

Die Attach equipment

Job description

Analog Devices in Penang seeks an experienced Semiconductor Packaging Engineer to develop, qualify, and optimize Die Attach and Flip Chip assembly processes for high-volume manufacturing. You will provide production support, perform DOE, and collaborate with equipment, materials, and product teams to drive yield, reliability, and process documentation while upholding quality standards.

The role emphasizes continuous improvement and transfer of processes from development to manufacturing with