Innovative Package Design Engineer (EM & RF)

NXP Semiconductors NV; Kuala Lumpur; On-site; MYR 110,000 - 190,000; Full time

Job summary

NXP Semiconductors NV is seeking a senior package design engineer in Kuala Lumpur to deliver optimized packaging solutions for new products. You will run EM modeling and work with SoC/PCB teams to maximize electrical performance and cost efficiency.

The role requires a strong background in microelectronics packaging, RF design at GHz frequencies, and collaboration across global teams. Excellent communication and a proactive mindset are essential for success.

Qualifications

• MSEE+ with experience in microelectronics packaging and EM modeling.
• Strong background in EM modeling and simulation tools (HFSS, Q3D, AWR, CST Microwave Studio, Keysight EMPro, ADS, Cadence) is preferred.
• RF design experience with GHz wired & wireless modeling is preferred.
• Understand electrical design of IO interfaces (LVDS, DDR, SerDes) used in semiconductor industry.
• PCB design experience or collaboration with PCB designers is a plus.
• Knowledge of BEOL design is a plus.
• Team player with a positive attitude, self-driven and innovative.
• Excellent written and verbal communication skills required.
• Ability to work in a dynamic, fast-paced global/local team environment.

Responsibilities

• Provide optimized package design solutions for New Product and New Technology Introductions (NPI, NTI).
• Define packages that meet product requirements for electrical performance, manufacturability, and cost.
• Run electromagnetic modeling and document results.
• Collaborate with SoC and PCB teams to optimize package performance.
• Provide electrical design rules to the Package Design Layout team and optimize layouts using modeling data.
• Provide package electrical data or models to BL team for system-level simulation.

Skills

Team player

Communication skills

Proactive mindset

Innovative outlook

Education

MSEE+

Tools

HFSS

Q3D

AWR

CST Microwave Studio

Keysight EMPro

ADS

Cadence S&P/Power Integrity tools

Job description

NXP Semiconductors NV is seeking a senior package design engineer in Kuala Lumpur to deliver optimized packaging solutions for new products. You will run EM modeling and work with SoC/PCB teams to maximize electrical performance and cost efficiency.

The role requires a strong background in microelectronics packaging, RF design at GHz frequencies, and collaboration across global teams. Excellent communication and a proactive mindset are essential for success.