NPI Process Development Engineer

NXP Semiconductors; Kuala Lumpur; On-site; MYR 70,000 - 110,000; Full time

Job summary

NXP Semiconductors in Malaysia is seeking a packaging engineer to develop and qualify new LQFP and BGA packages for automotive assembly.

You will lead process characterization, collaborate with cross-functional teams, and drive improvements in quality, yield, and cost while documenting specs and procedures.

The role requires 3–6 years in semiconductor assembly and hands-on experience with laser/plasma dicing, wire bonding, die attach, and mold processes.

Qualifications

• 3–6 years of semiconductor assembly experience for automotive customers.
• Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA packing development.
• Strong knowledge in process characterization for key processes such as laser dicing, plasma dicing, die bond, wire bonding, mold, ball attach, marking.
• Great interpersonal skills, leadership, results-oriented, self-driven.
• Proficient in SPC and Process Control; good problem-solving skills.
• Microsoft Office proficiency; project management knowledge is a plus.

Responsibilities

• Develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
• Responsible for quality, yield, cost and process improvement activities.
• Document process documentation, process specs, standard work instruction, OCAP, QIT, etc.
• Collaborate with cross-functional teams to resolve conflicts and make fast decisions to avoid risks.
• Take ownership to work with upper management to align scope and direction of key projects.

Skills

Semiconductor assembly

LQFP

MAPBGA

SiP

FCCSP

FCBGA

Process characterization

SPC

Process control

Statistical methods

Problem-solving

MS Office

Project management

PowerPoint

Excel Macro

Word

Tools

PowerPoint

Excel Macro

Word

Job description

• Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
• Responsible for quality, yield, cost and process improvement activities.
• Responsible for process documentation, process spec, standard work instruction, OCAP, QIT etc.
• Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
• Take ownership to work closely with upper management to align scope and direction of key projects.

Requirements

• 3-6 years of work experience with semiconductor assembly background for automotive customers.
• Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.
• Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.
• Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.
• Good SPC, Process Control and other relevant statistical & problem-solving skills
• Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.

More information about NXP in Malaysia...