Wire Bonding Technician II – Semiconductor Manufacturing

Onsemi

Seremban

On-site

MYR 27,900 - 39,060

Full time

14 days+

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Job summary

Onsemi in Malaysia is seeking skilled Technicians to support semiconductor manufacturing operations, focusing on wire bonding and related processes. The role involves operating and monitoring wire bonder machines, performing setups, and ensuring output meets Onsemi quality standards.

Ideal candidates hold a Certificate/Diploma in Electrical, Mechanical or Mechatronics, possess basic troubleshooting and machine-handling skills, and are willing to work 12-hour shifts in a fast-paced environment.

Qualifications

  • Certificate/Diploma in Electrical/Mechanical/Mechatronics or related fields.
  • Able to work in shift.
  • Basic troubleshooting and machine-handling skills.
  • Good teamwork, discipline, and communication skills.

Responsibilities

  • Operate and monitor wire bonder machines to ensure stable production output.
  • Perform wire bond processes according to SOP, work instructions, and Onsemi quality standards.
  • Machine model involve will be ASM (Extreme family, Gocu, Eagle 60AP, ) & Kns ( Connx Plus)
  • Conduct machine setup Minor/Major, alignment, recipe loading, and basic parameter adjustments.
  • Perform regular machine checks, cleaning, and minor preventive maintenance.
  • Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly.
  • Assist in troubleshooting equipment issues and support engineering improvement activities.
  • Record production data accurately in system and ensure proper documentation.
  • Ensure workplace 5S, safety compliance, and proper ESD handling at all times.

Skills

Basic troubleshooting
Teamwork
Communication
Discipline
ESD compliance

Education

Certificate/Diploma in Electrical/Mechanical/Mechatronics

Tools

Wire bonding equipment

Job description

Onsemi in Malaysia is seeking skilled Technicians to support semiconductor manufacturing operations, focusing on wire bonding and related processes. The role involves operating and monitoring wire bonder machines, performing setups, and ensuring output meets Onsemi quality standards.

Ideal candidates hold a Certificate/Diploma in Electrical, Mechanical or Mechatronics, possess basic troubleshooting and machine-handling skills, and are willing to work 12-hour shifts in a fast-paced environment.

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