Wire Bonding & Assembly Engineering Technician

NXP Semiconductors; Malaysia; Remote; MYR 36,000 - 60,000; Full time

Job summary

NXP Semiconductors, based in Malaysia, offers opportunities in our manufacturing and engineering support teams. This role targets candidates with a Diploma in electrical, mechanical, or mechatronics engineering and 2–5 years of hands-on experience in a manufacturing setting, focusing on assembly equipment and wire bonding.

We seek detail-oriented individuals with strong communication and teamwork skills to thrive in a fast-paced production environment and contribute to advanced, secure

Qualifications

• Diploma in electrical engineering, mechanical engineering, mechatronics, or related field.
• 2–5 years hands-on experience in manufacturing, production, or engineering support roles.
• Strong mechanical or electrical aptitude with hands-on experience with assembly equipment; wire bonding preferred.
• Detail-oriented with good communication and teamwork in a fast-paced environment.

Skills

Technical Proficiency

Hands-on assembly equipment

Wire bonding

Communication

Education

Diploma in electrical engineering, mechanical engineering, or mechatronics

Job description

NXP Semiconductors, based in Malaysia, offers opportunities in our manufacturing and engineering support teams. This role targets candidates with a Diploma in electrical, mechanical, or mechatronics engineering and 2–5 years of hands-on experience in a manufacturing setting, focusing on assembly equipment and wire bonding.

We seek detail-oriented individuals with strong communication and teamwork skills to thrive in a fast-paced production environment and contribute to advanced, secure