BGA Wire Bond Process Technician: Optimize Quality & Yield

NXP Semiconductors; Kuala Lumpur; On-site; MYR 67,000 - 112,000; Full time

Job summary

NXP Semiconductors is seeking a production process technician to support wire bond manufacturing. You will perform machine setup, conversion, and qualification for wire bond equipment, and monitor production to meet specifications.

Join a global leader in secure connectivity solutions. You will analyze process data, investigate defects, and contribute to cost reduction and productivity initiatives while maintaining quality and delivery targets.

Responsibilities

• Perform machine setup, conversion, and qualification for wire bond equipment.
• Monitor daily production performance and ensure compliance with process specifications.
• Support production activities to achieve output, quality, and delivery targets.
• Perform lot buy-off and process verification before production release.
• Monitor critical wire bond parameters and maintain process stability.
• Conduct routine process audits and inspections.
• Perform process characterization and parameter optimization activities.
• Analyze process data and identify trends affecting quality or yield.
• Troubleshoot wire bond defects and support engineers for root cause analysis.
• Support cost reduction and productivity enhancement initiatives.

Job description

NXP Semiconductors is seeking a production process technician to support wire bond manufacturing. You will perform machine setup, conversion, and qualification for wire bond equipment, and monitor production to meet specifications.

Join a global leader in secure connectivity solutions. You will analyze process data, investigate defects, and contribute to cost reduction and productivity initiatives while maintaining quality and delivery targets.