FE ASSY DIE BOND PROCESS TECHNICIAN

NXP Semiconductors; Kuala Lumpur; On-site; MYR 38,000 - 66,000; Full time

Job summary

NXP Semiconductors in Malaysia is seeking a Diploma-qualified engineer to perform die bond process tasks on quality hold material. You will work closely with equipment and manufacturing teams to optimize DB processes and techniques.

You will help resolve DB-related issues to minimize production downtime, apply attention to detail and troubleshooting skills, and contribute to a safe, efficient production environment.

Qualifications

• Diploma or above in Engineering or a related field.
• Working experience with DB process is preferable and recommended.
• Strong attention to detail and technical troubleshooting skills.

Responsibilities

• Perform die bond process task on quality hold material.
• Collaborate with equipment & manufacturing team to improve DB processes and techniques.
• Assist in resolving DB-related issues to minimize production downtime.

Skills

Attention to detail

Troubleshooting

Team collaboration

Education

Diploma or above in Engineering

Job description

NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.com Bright Minds. Bright Futures. We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.

Commitment At NXP. We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress.

Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind.

We have programs in place focused on diversity, inclusion and equality.

Key Responsibilities

• Perform die bond process task on quality hold material
• Collaborate with equipment & manufacturing team to improve DB processes and techniques.
• Assist in resolving DB-related issues to minimize production downtime.

Requirements

• Diploma or above in Engineering or a related field.
• Working experience with DB process is preferable and recommended.
• Strong attention to detail and technical troubleshooting skills.