Dicing & Pick & Place Manufacturing Engineer (Optics)

Heptagon Photonics Malaysia Sdn Bhd; Iskandar Puteri; On-site; MYR 100,000 - 156,000; Full time

Job summary

Heptagon Photonics Malaysia Sdn Bhd in Iskandar Puteri invites a Manufacturing Engineer to develop and optimize Dicing and Pick & Place processes for optical wafers and related substrates. You will collaborate with production, quality, equipment, and product engineering teams to support new product introductions and high-volume manufacturing.

The role focuses on process recipes, control plans, DOE, SPC, CAPA, and ensuring yield, throughput, and traceability while maintaining cleanroom and ESD

Qualifications

• Bachelor's degree or above in Mechanical Engineering, Mechatronics, Materials Science, Manufacturing Engineering, Electrical Engineering, or related fields.
• Minimum 3 years of hands-on experience in Dicing, die handling, Pick & Place, precision assembly, or related process development and sustaining operations.
• Hands-on knowledge of wafer/substrate dicing, blade selection, tape mounting, singulation, cleaning, and defect control.
• Hands-on experience with automated or semi-automated Pick & Place systems, machine vision, fiducial alignment, nozzles/end-effectors, and precision component handling.
• Ability to interpret drawings, tolerances, inspection criteria, process data, and equipment logs.
• Familiarity with DOE, SPC, FMEA, control plans, capability analysis, RCA, and CAPA.

Responsibilities

• Develop, implement, and refine Dicing and Pick & Place processes for optical wafers, fused silica, silicon, glass, and other substrates or components.
• Optimize dicing parameters including blade type, spindle speed, feed rate, cut depth, coolant flow, tape selection, mounting, alignment, and cleaning method.
• Monitor and improve kerf width, edge chipping, cracking, delamination, contamination, die breakage, dimensional accuracy, and post-dicing cleanliness.
• Develop and optimize Pick & Place recipes including vision alignment, fiducial recognition, pick height, placement force, motion profile, nozzle selection, vacuum settings, and placement coordinates.
• Ensure stable component pick-up and placement performance, including placement accuracy, orientation, component integrity, surface protection, and traceability.
• Conduct DOE to improve process capability, throughput, cycle time, yield, and cost.
• Collaborate with maintenance and equipment teams to operate, troubleshoot, calibrate, and maintain Dicing and Pick & Place equipment and ensure uptime.
• Implement SPC, control plans, and FMEA for process control and risk management.
• Document SOPs, work instructions, process parameters, recipes, inspection criteria, maintenance requirements, and best practices.
• Conduct root cause analysis and implement CAPA for process excursions, equipment alarms, yield loss, and product damage.

Skills

Analytical problem solving

Documentation discipline

Cross team communication

Teamwork

Education

Bachelor's degree or above in Mechanical Engineering, Mechatronics, Materials Science, Manufacturing Engineering, Electrical Engineering, or related fields

Tools

Pick & Place systems

Machine vision

Job description

Heptagon Photonics Malaysia Sdn Bhd in Iskandar Puteri invites a Manufacturing Engineer to develop and optimize Dicing and Pick & Place processes for optical wafers and related substrates. You will collaborate with production, quality, equipment, and product engineering teams to support new product introductions and high-volume manufacturing.

The role focuses on process recipes, control plans, DOE, SPC, CAPA, and ensuring yield, throughput, and traceability while maintaining cleanroom and ESD