Manufacturing Engineer (Dicing, Pick & Place)

Heptagon Photonics Malaysia Sdn Bhd; Iskandar Puteri; In loco; MYR 100.000 - 156.000; Tempo pieno

Descrizione del lavoro

Heptagon Photonics Malaysia Sdn Bhd in Iskandar Puteri invites a Manufacturing Engineer to develop and optimize Dicing and Pick & Place processes for optical wafers and related substrates. You will collaborate with production, quality, equipment, and product engineering teams to support new product introductions and high-volume manufacturing.

The role focuses on process recipes, control plans, DOE, SPC, CAPA, and ensuring yield, throughput, and traceability while maintaining cleanroom and ESD

Competenze

• Bachelor's degree or above in Mechanical Engineering, Mechatronics, Materials Science, Manufacturing Engineering, Electrical Engineering, or related fields.
• Minimum 3 years of hands-on experience in Dicing, die handling, Pick & Place, precision assembly, or related process development and sustaining operations.
• Hands-on knowledge of wafer/substrate dicing, blade selection, tape mounting, singulation, cleaning, and defect control.
• Hands-on experience with automated or semi-automated Pick & Place systems, machine vision, fiducial alignment, nozzles/end-effectors, and precision component handling.
• Ability to interpret drawings, tolerances, inspection criteria, process data, and equipment logs.
• Familiarity with DOE, SPC, FMEA, control plans, capability analysis, RCA, and CAPA.

Mansioni

• Develop, implement, and refine Dicing and Pick & Place processes for optical wafers, fused silica, silicon, glass, and other substrates or components.
• Optimize dicing parameters including blade type, spindle speed, feed rate, cut depth, coolant flow, tape selection, mounting, alignment, and cleaning method.
• Monitor and improve kerf width, edge chipping, cracking, delamination, contamination, die breakage, dimensional accuracy, and post-dicing cleanliness.
• Develop and optimize Pick & Place recipes including vision alignment, fiducial recognition, pick height, placement force, motion profile, nozzle selection, vacuum settings, and placement coordinates.
• Ensure stable component pick-up and placement performance, including placement accuracy, orientation, component integrity, surface protection, and traceability.
• Conduct DOE to improve process capability, throughput, cycle time, yield, and cost.
• Collaborate with maintenance and equipment teams to operate, troubleshoot, calibrate, and maintain Dicing and Pick & Place equipment and ensure uptime.
• Implement SPC, control plans, and FMEA for process control and risk management.
• Document SOPs, work instructions, process parameters, recipes, inspection criteria, maintenance requirements, and best practices.
• Conduct root cause analysis and implement CAPA for process excursions, equipment alarms, yield loss, and product damage.

Conoscenze

Analytical problem solving

Documentation discipline

Cross team communication

Teamwork

Formazione

Bachelor's degree or above in Mechanical Engineering, Mechatronics, Materials Science, Manufacturing Engineering, Electrical Engineering, or related fields

Strumenti

Pick & Place systems

Machine vision

Descrizione del lavoro

Manufacturing Engineer (Dicing, Pick & Place)

The Manufacturing Engineer is responsible for developing, implementing, and optimizing manufacturing processes to ensure efficient production, high quality, and cost-effectiveness. This role involves close collaboration with production, quality, equipment, and product engineering teams to support product introduction, continuous improvement, and scaling to high-volume manufacturing. This position is responsible for developing, optimizing, and sustaining Dicing and Pick & Place processes used in optical and semiconductor-related manufacturing. The role establishes robust process recipes and controls cut quality, component integrity, placement accuracy, yield, throughput, and traceability for silicon, fused silica, glass, and other applicable substrates or components. This role is critical in preventing chipping, cracking, contamination, mis-pick, misalignment, and handling damage while meeting optical, cosmetic, and dimensional specifications.

Key responsibilities

Develop, implement, and refine Dicing and Pick & Place processes for optical wafers, fused silica, silicon, glass, and other applicable substrates or components.

Optimize dicing parameters including blade type, spindle speed, feed rate, cut depth, coolant flow, tape selection, mounting, alignment, and cleaning method.

Monitor and improve kerf width, edge chipping, cracking, delamination, contamination, die breakage, dimensional accuracy, and post-dicing cleanliness.

Develop and optimize Pick & Place recipes including vision alignment, fiducial recognition, pick height, placement force, motion profile, nozzle selection, vacuum settings, and placement coordinates.

Ensure stable component pick-up and placement performance, including placement accuracy, orientation, component integrity, surface protection, and traceability.

Conduct DOE (Design of Experiments) to improve process capability, throughput, cycle time, yield, and cost.

Collaborate with maintenance and equipment teams to operate, troubleshoot, calibrate, and maintain Dicing and Pick & Place equipment and ensure uptime.

Implement SPC (Statistical Process Control), control plans, and FMEA (Failure Mode and Effects Analysis) for process control and risk management.

Document SOPs, work instructions, process parameters, recipes, inspection criteria, maintenance requirements, and best practices.

Conduct root cause analysis and implement CAPA for process excursions, equipment alarms, yield loss, and product damage.

Support equipment installation, process qualification, product transfer, sample builds, and production ramp-up at the JB plant.

Train production teams and ensure compliance with EHS requirements, cleanroom protocols, ESD control, machine safety, and approved chemical handling.

About you

Bachelor's degree or above in Mechanical Engineering, Mechatronics, Materials Science, Manufacturing Engineering, Electrical Engineering, or related fields.

Minimum 3 years of hands‑on experience in Dicing, die handling, Pick & Place, precision assembly, or related process development and sustaining operations, preferably in optics, semiconductor, MEMS, microelectronics, or precision manufacturing industries.

Hands‑on knowledge of wafer/substrate dicing, blade selection, tape mounting, singulation, cleaning, and defect control.

Hands‑on experience with automated or semi‑automated Pick & Place systems, machine vision, fiducial alignment, nozzles/end‑effectors, and precision component handling.

Ability to interpret drawings, tolerances, inspection criteria, process data, and equipment logs.

Familiarity with DOE, SPC, FMEA, control plans, capability analysis, RCA, and CAPA.

Analytical problem‑solving, documentation discipline, and cross‑team communication.

Familiarity with cleanroom practices, ESD control, wafer/component handling, and contamination control.

Able to work extended periods in ISO‑classified cleanrooms with PPE and handle approved chemicals and precision instruments.

Strong teamwork spirit, sense of responsibility, results‑oriented mindset, and practical work ethic.

Unlock job insights

Your application will include the following questions:

• Which of the following statements best describes your right to work in Malaysia?
• What's your expected monthly basic salary?
• How many years' experience do you have as a Manufacturing Engineer?
• Which of the following types of qualifications do you have?
• Do you have Engineering Drawing Interpretation experience?
• How much notice are you required to give your current employer?
• How many years' experience do you have as an automotive engineer?