Technology Specialist

Sanmina-SCI Systems de México; Chennai District; On-site; INR 1,800,000 - 3,000,000; Full time

Job summary

Sanmina-SCI Systems de México is seeking a Mechanical Design Engineer with CFD/FEA expertise to drive thermal management for IT equipment. The role focuses on CFD/thermal simulations, static and dynamic analysis, and design validation across 1U to 10U server platforms.

The ideal candidate holds an M.E/M.Tech/Ph.D in Mechanical Engineering with 12+ years of hands-on experience and proficiency in Solidworks/ANSYS, Flotherm, and Icepak to deliver robust cooling solutions.

Qualifications

• M.E / M.Tech / Ph.D in Mechanical Engineering with 12+ years CFD/FEA experience.
• Proficient in Solidworks Simulation and ANSYS Mechanical.
• Experience with Flotherm, Solidworks Flow Simulation and ANSYS Icepak.
• Expertise in active and passive cooling to meet thermal criteria across applications.
• Specializing in static and dynamic analysis, including shock, vibration, seismic, and drop testing.

Responsibilities

• Lead CFD/FEA simulations for thermal and mechanical validation of server platforms.
• Develop thermal strategies for data centers, telecom and storage devices.
• Conduct DoE, material property estimation, and failure analysis per CTQ specs.
• Validate designs against international standards for IT equipment.

Skills

CFD & FEA

Thermal analysis

Vibration analysis

Dynamic analysis

Education

M.E / M.Tech / Ph.D in Mechanical Engineering

Tools

Solidworks

ANSYS Mechanical

Flotherm

Solidworks Flow Simulation

ANSYS Icepak

Job description

Mechanical Design Engineer 5

Job Purpose: Key Responsibilities and Focus Areas:

CFD

1. 1. Specializing in thermal simulations including fluid flow, heat transfer, multiphase flow and related engineering problems.
2. 2. Articulate of cabinet/chassis/module/board level thermal analysis for key performance evaluation; conduct thermal/CFD simulations to contribute for NPD and qualifications.
3. 3. Expertise in active and passive cooling systems to meet thermal criteria across applications.
4. 4. Applications include data centers, telecommunication devices, storage devices, energy storage systems, thermostats & display systems in medical devices and navigation systems in marine vehicles (heat dissipation ranges from 20W to 4kW or more).
5. 5. Lead the development and implementation of thermal and mechanical requirements for server platform systems ranging from 1U to 10U form factors.
6. 6. Conduct extensive thermal simulations using CFD tools on PCle and custom form factor circuit cards to verify designs: Generation of thermal curves to qualify thermal level of PCIe Cards.
7. 7. Participate in thermal technology research and development to meet the thermal requirements of future IT equipments.
8. 8. Executed estimation of material properties for efficient heat dissipation by mechanical testing, thermal testing, and surface testing and intrinsic transient testing; diagnosis of DoE and failure analysis based on CTQ specifications.
9. 9. Thermal test validation of IT equipment including server/storage/switch product as per international standards.
10. 10. Exhibit key DRC, LVS & footprint and GERBER validation: Adopt thermal design for PCB placement and routing optimization as per the thermal simulations.
11. 11. Drive fan tuning and system thermal optimization efforts.
12. 12. Capability to analyze and reduce the system noise inside the enclosures by simulation output.
13. 13. Knowledge on IP ratings of enclosures.

FEA

1. 1. Specializing in both Static and Dynamic Analysis, encompassing Shock, Vibration, Seismic, and Drop Testing.
2. 2. Experience in physical testing of data center racks (various ranges up to 52U height) such as payload, tilt, impact and drop tests.
3. 3. Experience in performing Seismic (Dynamic) analysis to meet the GR-63 standards for indoor enclosures at high seismic zone (Level 4).
4. 4. Strong expertise in performing dynamic shock analysis to qualify products for Operational shock (40G) and crash hazard shock (75G).
5. 5. Capability to perform dynamic vibration analysis to evaluate product for random vibration (0 to 500Hz) and shipboard vibration (4 to 33Hz).
6. 6. Experience in creation of optimal product design for suitable and cost-effective products by structural analysis.
7. 7. Knowledge on GR-63 and MIL standards.
8. 8. Capability to extract information about displacements, velocities, accelerations, joint reactions, and inertial loads of all the mechanism components, as well as the power necessary to sustain the motion.
9. 9. Conduct interference checks in real time, and provides the exact spatial and time positions of all mechanism components as well as the exact interfering volumes.

Qualifications Required: (Education, experience, skills, etc. Please be specific)

• - M.E / M.Tech / Ph.D in Mechanical Engineering with over twelve years of experience in handling CFD and FEA
• - Experience in Solidworks Simulation and ANSYS Mechanical.
• - Experience in Flotherm, Solidworks Flow Simulation and ANSYS Icepak.
• - Expertise in active and passive cooling systems to meet thermal criteria across applications.
• - Specializing in both Static and Dynamic Analysis, encompassing Shock, Vibration, Seismic, and Drop Testing.
• - Specializing in thermal simulations including fluid flow, heat transfer, multiphase flow and related engineering problems.
• - Expertise in data center cooling solutions designed to manage the intense thermal loads of AI infrastructure and high-density servers.