Thermal simulation engineering

Quest Global; Bengaluru; On-site; INR 600,000 - 1,200,000; Full time

Benefits offered by this job

VPay and other benefits of regular employees

Job summary

Quest Global is looking for a CFD / Thermal Simulation Engineer in Bengaluru, India. The successful candidate will lead high-fidelity thermal and fluid flow simulations, support electronics thermal design, and collaborate with cross-functional teams. Required qualifications include proven expertise in OpenFOAM, strong foundations in heat transfer and fluid dynamics, and proficiency in Python and/or C++. The position offers competitive benefits along with opportunities for professional growth.

Qualifications

• Proven expertise in OpenFOAM, including solver selection and troubleshooting.
• Strong theoretical foundation in heat transfer and fluid dynamics.
• Hands-on experience with meshing and post-processing of CFD results.

Responsibilities

• Lead CFD and thermal simulations using OpenFOAM.
• Develop and analyze models for heat transfer and fluid flow.
• Perform electronics cooling simulations at component and system levels.
• Collaborate with cross-functional teams to support thermal design decisions.

Skills

OpenFOAM

Python

C++

Heat Transfer

Fluid Dynamics

Analytical Skills

Education

Master's degree in Mechanical Engineering, Aerospace Engineering, Thermal Engineering, or related field

Tools

OpenFOAM

Job description

CFD / Thermal Simulation Engineer – Electronics Cooling

We are seeking a highly skilled CFD / Thermal Simulation Engineer with strong expertise in OpenFOAM and electronics thermal management. The successful candidate will be responsible for performing high‑fidelity thermal and fluid flow simulations, supporting electronics thermal design decisions, and translating complex simulation results into actionable engineering recommendations.

Key Responsibilities

• Lead CFD and thermal simulations using OpenFOAM, including solver selection, case setup, validation, debugging, and performance optimization.
• Develop and analyze models for heat transfer and fluid flow, applying strong theoretical fundamentals to practical engineering problems.
• Perform electronics cooling simulations at both component and system levels, including:
  • PCBs and component-level heat sources
  • Heat sinks and thermal interface materials
  • Fan- and blower-driven airflow within enclosures
• Collaborate with cross-functional teams (hardware design, mechanical design, systems engineering) to support thermal design decisions.
• Analyze simulation results and present findings in a clear, concise, and actionable manner to technical and non-technical stakeholders.
• Create and maintain meshes, post‑processing workflows, and validation procedures to ensure model accuracy.
• Develop automation scripts and tools using Python and/or C++ to improve simulation efficiency and repeatability.
• Support model verification, convergence studies, and comparison with experimental or test data where available.
• Document simulation methodologies, assumptions, and results according to engineering best practices.

Required Qualifications

• Proven expertise in OpenFOAM (Must‑Have), including solver selection, setup, customization, and troubleshooting.
• Strong theoretical foundation in heat transfer and fluid dynamics.
• Hands‑on experience with meshing and post‑processing of CFD/thermal simulation results.
• Proficiency in Python and/or C++ for workflow automation and data processing.
• Excellent analytical and problem‑solving skills.

Preferred Qualifications

• Experience in Electronics Thermal Design, including PCB‑level and system‑level modeling.
• Familiarity with electronics cooling components such as heat sinks, fans, and enclosures.
• Master’s degree (preferred) or higher in Mechanical Engineering, Aerospace Engineering, Thermal Engineering, or a related field.
• Experience translating simulation results into design recommendations that influence product decisions.

Communication & Collaboration

• Strong written and verbal communication skills.
• Ability to clearly explain complex simulation data to diverse stakeholders.
• Comfortable working in multi‑disciplinary engineering teams.

Nice‑to‑Have Skills

• High‑performance computing (HPC) or parallel simulation experience.
• Optimization or parametric studies for thermal design improvement.
• Exposure to electronics thermal standards or best practices.

Benefits

VPay and other benefits of regular employees.