Cfd Engineer

Utthunga Technologies; Bengaluru; On-site; INR 1,200,000 - 1,800,000; Full time

Job summary

Utthunga Technologies in Bengaluru seeks a skilled CAE/CFD Engineer to conduct CFD and thermal analyses for electronic enclosures, PCBs, and power electronics. The role emphasizes multiphysics simulations and validation against experimental data, including toxicity-free materials and safe operating limits.

The candidate should excel in ANSYS Workbench/Fluent/Icepak, perform multiphysics coupling, and collaborate with global R&D teams to optimize heatsink designs and airflow.

Qualifications

• Experience in CFD/thermal simulations for electronics enclosures and PCB assemblies.
• Proficient in ANSYS Mechanical for linear and nonlinear analyses.
• Experience with heatsink design and airflow optimization.
• Ability to validate simulations with experimental data.

Responsibilities

• Perform CFD and thermal simulations for electronic enclosures, PCBs, power electronics, battery packs, and high-temperature systems.
• Conduct FEA including linear/non-linear structural analysis, vibration, and drop-test simulations using ANSYS Mechanical to ensure reliability.
• Develop and optimize thermal management solutions by recommending heatsink designs, fan placement, and airflow optimization.
• Build and validate CFD models involving heat transfer, natural convection, forced convection, radiation, phase change, and fluid flow.
• Perform multiphysics simulations to support design, optimization, and validation of electrification and electronic products.
• Validate simulation results using experimental and in-house test data, ensuring model accuracy.

Skills

CFD & Thermal

ANSYS Workbench

Fluids & Heat Transfer

Multiphysics Simulation

Creo CAD

Tools

Fluent

Icepak

Creo CAD

Job description

Job Title: CAE/CFD Engineer

Job Description

We are seeking a skilled and motivated CAE/CFD Engineer with 38 years of experience in simulating, optimizing, and validating new electrification products ,The ideal candidate should have a strong background in thermal simulation workflows, meshing techniques, and Multiphysics analysis,CFD/CAE simulationsalong with a working knowledge of CAD tools like Creo.

Roles & Responsibilities

• Perform Computational Fluid Dynamics (CFD) and thermal simulations for electronic enclosures, PCBs, power electronics, battery packs, and high-temperature systems.
• Conduct Finite Element Analysis (FEA), including linear/non-linear structural analysis, vibration, and drop-test simulations using ANSYS Mechanical to ensure electromechanical reliability.
• Develop and optimize thermal management solutions by recommending heatsink designs, fan placement, and airflow optimization to eliminate thermal bottlenecks.
• Build and validate CFD models involving heat transfer, natural convection, forced convection, radiation, phase change (melting), and fluid flow.
• Perform multiphysics simulations to support the design, optimization, and validation of next-generation electrification and electronic products.
• Validate simulation results using experimental and in-house test data, ensuring model accuracy and reliability.
• Collaborate with test engineering and facility operations teams for data acquisition, post-processing, and simulation validation.
• Standardize, improve, and document CFD and simulation methodologies, incorporating validation feedback and industry best practices.
• Develop and maintain automation scripts for simulation workflows, data processing, analysis, and report generation.
• Work closely with cross-functional and global R&D teams to support product development through simulation-driven design.
• Provide technical guidance to engineering teams by building modeling and simulation capabilities and supporting both standard and high-complexity analyses.
• Deliver high-quality simulation results, technical reports, and design recommendations to stakeholders, enabling informed engineering decisions and accelerated product development.

Mandatory Skills:

Deep expertise in Ansys Workbench, Fluent, Icepak,structural/vibration skills and thermal/fluid skills ,Familiarity with BGAs, TIMs (Thermal Interface Materials), and PCB stack-ups.

Desirable Skills:

Strong grasp of heat transfer, fluid mechanics, electromagnetics interaction, and material properties.

Skills to be evaluated on

Ansys-Workbench-Fluent-Icepakstructural/vibration-skills-and-thermal/fluid-skills-Familiarity-with-BGAs-TIMs-(Thermal-Interface-Materials)-and-PCB-stack-ups.