Technology Specialist

Sanmina; Chennai District; On-site; INR 1,200,000 - 2,400,000; Full time

Job summary

Sanmina in Chennai is seeking a Mechanical Design Engineer 5 to lead thermal and mechanical analyses for server and data center applications.

You will perform CFD/FEA simulations, develop cooling strategies for high-density IT equipment, validate designs to meet stringent thermal criteria, and collaborate with cross-functional teams across NPD and qualification programs.

Opportunity to influence product reliability and performance while leveraging industry standards and advanced simulation tools.

Qualifications

• M.E / M.Tech / Ph.D in Mechanical Engineering with over twelve years of CFD/FEA experience.
• Experience in SolidWorks Simulation and ANSYS Mechanical.
• Experience in Flotherm, SolidWorks Flow Simulation and ANSYS Icepak.
• Expertise in active and passive cooling to meet thermal criteria across applications.

Responsibilities

• Specializing in thermal simulations including fluid flow, heat transfer, multiphase flow and related problems.
• Lead thermal analysis for server platforms 1U–10U and data center equipment.
• Perform CFD/FEA simulations to verify designs and generate thermal curves.
• Drive fan tuning and system thermal optimization efforts.
• Capability to analyze and reduce noise within enclosures by simulation output.

Skills

CFD

FEA

Thermal simulations

Vibration analysis

Seismic analysis

Education

M.E / M.Tech / Ph.D in Mechanical Engineering

Tools

SolidWorks Simulation

ANSYS Mechanical

Flotherm

SolidWorks Flow Simulation

ANSYS Icepak

Job description

Job Description:

Mechanical Design Engineer 5

Job Purpose: Key Responsibilities and Focus Areas:

• Specializing in thermal simulations including fluid flow, heat transfer, multiphase flow and related engineering problems.
• Articulate of cabinet/chassis/module/board level thermal analysis for key performance evaluation; conduct thermal/CFD simulations to contribute for NPD and qualifications.
• Expertise in active and passive cooling systems to meet thermal criteria across applications.
• Applications include data centers, telecommunication devices, storage devices, energy storage systems, thermostats & display systems in medical devices and navigation systems in marine vehicles (heat dissipation ranges from 20W to 4kW or more).
• Lead the development and implementation of thermal and mechanical requirements for server platform systems ranging from 1U to 10U form factors.
• Conduct extensive thermal simulations using CFD tools on PCle and custom form factor circuit cards to verify designs: Generation of thermal curves to qualify thermal level of PCIe Cards.
• Participate in thermal technology research and development to meet the thermal requirements of future IT equipments.
• Executed estimation of material properties for efficient heat dissipation by mechanical testing, thermal testing, and surface testing and intrinsic transient testing; diagnosis of DoE and failure analysis based on CTQ specifications.
• Thermal test validation of IT equipment including server/storage/switch product as per international standards.
• Exhibit key DRC, LVS & footprint and GERBER validation: Adopt thermal design for PCB placement and routing optimization as per the thermal simulations.
• Drive fan tuning and system thermal optimization efforts.
• Capability to analyze and reduce the system noise inside the enclosures by simulation output.
• Knowledge on IP ratings of enclosures.

FEA

• Specializing in both Static and Dynamic Analysis, encompassing Shock, Vibration, Seismic, and Drop Testing.
• Experience in physical testing of data center racks (various ranges up to 52U height) such as payload, tilt, impact and drop tests.
• Experience in performing Seismic (Dynamic) analysis to meet the GR-63 standards for indoor enclosures at high seismic zone (Level 4).
• Strong expertise in performing dynamic shock analysis to qualify products for Operational shock (40G) and crash hazard shock (75G).
• Capability to perform dynamic vibration analysis to evaluate product for random vibration (0 to 500Hz) and shipboard vibration (4 to 33Hz).
• Experience in creation of optimal product design for suitable and cost-effective products by structural analysis.
• Knowledge on GR-63 and MIL standards.
• Capability to extract information about displacements, velocities, accelerations, joint reactions, and inertial loads of all the mechanism components, as well as the power necessary to sustain the motion.
• Conduct interference checks in real time, and provides the exact spatial and time positions of all mechanism components as well as the exact interfering volumes.

Qualifications Required: (Education, experience, skills, etc. Please be specific)

• M.E / M.Tech / Ph.D in Mechanical Engineering with over twelve years of experience in handling CFD and FEA
• Experience in Solidworks Simulation and ANSYS Mechanical.
• Experience in Flotherm, Solidworks Flow Simulation and ANSYS Icepak.
• Expertise in active and passive cooling systems to meet thermal criteria across applications.
• Specializing in both Static and Dynamic Analysis, encompassing Shock, Vibration, Seismic, and Drop Testing.
• Specializing in thermal simulations including fluid flow, heat transfer, multiphase flow and related engineering problems.
• Expertise in data center cooling solutions designed to manage the intense thermal loads of AI infrastructure and high-density servers.

Requirements: