Principal Engineer Unit Process Development

Infineon Technologies AG; Malacca; On-site; INR 1,500,000 - 2,700,000; Full time

Job summary

Infineon Technologies AG is seeking a senior unit process expert to lead Die Attach and Component Attach programs across development and manufacturing. The role partners with innovation, package development, and production teams across Europe and Asia to shape a long-term Unit Process Roadmap for processes, equipment, and materials.

The candidate will govern the Process Block Catalog and the Technical Process Chain, ensuring alignment with roadmaps and technology strategies.

Qualifications

• Degree, Master's Degree, or PhD in Mechanical Engineering, Materials Engineering, Materials Science, or related disciplines.
• More than 10 years of experience in the semiconductor industry.
• Extensive expertise in unit process development, particularly in Die Attach processes and/or Component Attach processes.
• Experience working in a multinational organization and leading teams within a cross-functional environment.
• Strong knowledge of semiconductor R&D, technology roadmap development, and technology realization.
• Good understanding of industry trends and competitor technologies.
• Familiarity with assembly subcontractor portfolios and intellectual property processes.

Responsibilities

• Responsible for Die Attach and Component Attach processes across development and manufacturing operations.
• Collaborate with innovation, package development, and production teams across Europe and Asia sites to develop and maintain a long-term Unit Process Roadmap covering processes, equipment, and materials.
• Govern the Process Block Catalog (PBC) and serve as the technical expert for the Technical Process Chain (TPC), ensuring key unit processes are clearly defined and aligned with roadmaps.
• Drive Design-to-Cost initiatives with a focus on key equipment suppliers, establishing strategic long-term partnerships to achieve a 30% reduction in investment cost per piece for new equipment introduced within the roadmap.

Skills

Unit process development

Die Attach processes

Component Attach processes

R&D leadership

Education

Master's or PhD in Mechanical Engineering

Materials Engineering

Materials Science

Tools

PBC knowledge

Job description

Responsible for Die Attach and Component Attach processes across development and manufacturing operations. Collaborate with innovation, package development, and production teams across Europe and Asia sites to develop and maintain a long-term Unit Process Roadmap covering processes, equipment, and materials, enabling faster time-to-market and minimizing development and manufacturing complexity. Support and govern Platform Unit Process Development by applying technical expertise and driving alignment within projects to address critical issues and agreements. Develop and maintain long-term strategies for the assigned unit processes, ensuring alignment across Backend operations, identifying gaps, and driving actions and projects to close them. Govern the Process Block Catalog (PBC) and serve as the technical expert for the Technical Process Chain (TPC), ensuring key unit processes are clearly defined and strictly aligned with the Process Block Catalog and Technology, Material, and Equipment Roadmaps. Drive Design-to-Cost initiatives with a focus on key equipment suppliers, establishing strategic long-term partnerships to achieve a 30% reduction in investment cost per piece for new equipment introduced within the roadmap.

Degree, Master's Degree, or PhD in Mechanical Engineering, Materials Engineering, Materials Science, or related disciplines. More than 10 years of experience in the semiconductor industry. Extensive expertise in unit process development, particularly in Die Attach processes (adhesive, film, soldering, sintering, diffusion soldering, preform, printing, etc.) and/or Component Attach processes (printing, component pick-and-place, reflow, ball attach, surface mount, etc.). Experience working in a multinational organization and leading teams within a cross-functional environment. Strong knowledge of semiconductor R&D, technology roadmap development, and technology realization. Good understanding of industry trends and competitor technologies. Familiarity with assembly subcontractor portfolios and intellectual property processes.

We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.