Senior Staff Engineer Unit Process Development Flip Chip

Infineon Technologies AG; Malacca; On-site; INR 1,200,000 - 1,800,000; Full time

Job summary

Infineon Technologies AG in India seeks a process development engineer to drive Front-of-Line and Die Attach process development, optimization, and qualification across new technologies.

You will lead DOE studies using JMP/Minitab, collaborate with suppliers, document specs and roadmaps, and mentor cross-functional teams to ensure quality and timely delivery.

Qualifications

• Master's or Bachelor's Degree in Engineering or a related discipline is required.
• Minimum 4 years of working experience in the semiconductor manufacturing industry or other relevant industries.
• Strong hands-on knowledge in Front-of-Line (FOL) and Die Attach processes, including Flip Chip, Flux Dip, and Reflow.
• Proficiency in DOE and statistical analysis using JMP or Minitab.

Responsibilities

• Conduct process development activities including parameter scouting, optimization, verification, characterization, and process freeze to meet project objectives.
• Develop innovative processes and characterization methodologies while performing risk assessments and identifying technical challenges.
• Support prototype and development sample builds and ensure effective technical communication and knowledge transfer to Operations.
• Prepare, maintain, and ensure accuracy of development-related documentation (Process Specifications, Assembly Design Rules, Process Roadmaps, FMEA, OJTI/WI, T32).
• Collaborate with suppliers on continuous improvement initiatives and perform verification/qualification for new tooling, equipment, and materials.
• Provide technical consultation and guidance to project teams to support daily activities and deliverables.
• Lead task forces and complex problem-solving using statistics and methodologies including Root Cause Analysis, 5 Whys, DMAIC, and 8D.
• Demonstrate strong communication, presentation, interpersonal and teamwork skills and the ability to lead cross-functional teams.
• Technical knowledge of material interactions within the die attach ecosystem and Six Sigma knowledge is advantageous.

Skills

Front-of-Line processes

Die Attach processes

Statistical analysis

JMP

Minitab

DOE

Communication

Teamwork

Education

Master's or Bachelor's Degree in Engineering or a related discipline

Tools

JMP

Minitab

Job description

Conduct process development activities, including process parameter scouting, optimization, verification, process characterization, and process freeze, to achieve project objectives in terms of timeline, quality, cost competitiveness, and manufacturability.

Develop innovative processes and process characterization methodologies for existing and new technologies, while performing risk assessments and identifying technical challenges.

Support prototype and development sample builds, and ensure effective technical communication and knowledge transfer to Operations.

Prepare, maintain, and ensure the accuracy of development-related documentation, including Process Specifications, Assembly Design Rules, Process Roadmaps, Failure Catalogues, Control Plans, FMEA, OJTI/WI, and T32.

Collaborate with suppliers on continuous improvement initiatives and perform verification and qualification activities for new tooling, equipment, and materials used in development projects.

Provide technical consultation and guidance to project teams to support the successful execution of daily activities and project deliverables.

Lead task forces and complex problem-solving activities using statistical and analytical methodologies, including Root Cause Analysis, 5 Whys, DMAIC, and 8D.

Master's or Bachelor's Degree in Engineering or a related discipline.

Minimum 4 years of working experience in the semiconductor manufacturing industry or other relevant industries.

Strong hands-on knowledge and technical expertise in Front-of-Line (FOL) and Die Attach processes, including Flip Chip, Flux Dip, and Reflow.

Proficiency in JMP, Minitab, or equivalent tools for Design of Experiments (DOE) and statistical analysis.

Strong analytical, problem‑solving, and project planning skills, with a strong sense of quality and urgency.

Strong communication, presentation, interpersonal, and teamwork skills, with the ability to work independently and lead cross‑functional teams.

Technical knowledge of material interactions within the die attach ecosystem and structured problem‑solving methodologies, including 8D and Six Sigma, is an added advantage.

We are on a journey to create the best Infineon for everyone.

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We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

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