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Infineon Technologies AG in India seeks a Senior Engineer Development Die Attach to join our R&D team to shape the future of technology and drive innovation in die attach processes.
The role requires a Master’s or Bachelor’s in Engineering, 3+ years in semiconductor manufacturing, and hands-on assembly process knowledge. You will mentor colleagues and contribute to IP generation and process improvements.
#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Senior Engineer Development Die Attach in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?
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#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game‑changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?
We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.
Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.
Please let your recruiter know if you need any accommodations during the interview process.
Learn more about our various contact channels and about Diversity & Inclusion at Infineon.