Lead Principal Engineer Technology Integration

Infineon Technologies AG; Malacca; On-site; INR 1,400,000 - 2,600,000; Full time

Job summary

Infineon Technologies AG in India invites applications for a role focused on drive technology integration for package platforms, ensuring process interactions meet requirements. You will partner with FE teams and own DFMEA/Process of Record initiatives, risk interaction assessments, and integration of BOM and process units.

The ideal candidate has a engineering degree with extensive IC/semiconductor experience, strong communication and cross-functional collaboration skills, and hands-on

Qualifications

• Bachelor's Degree in Engineering with IC/semiconductor experience (10+ years).
• Strong communication, collaboration, and negotiation skills.
• Knowledge of FE/BE and BE/BE interaction.
• Experience with 8D & PFMEA and DFMEA.
• Familiarity with internal package analysis and first-level reliability.

Responsibilities

• PBC and TPC assessment.
• Driver of Package Technology DFMEA Process of Record.
• Owner of Risk Interaction assessment and mitigation work packages.
• Integration of unit processes (BOM and Process) in package platform - Risk assessment, study interaction with other processes, process flow.
• Working partner for FE in FE/BE interaction and integration topics.
• Support Pre development for new Chip technology.

Skills

Communication

Collaboration

Negotiation

DFMEA/PFMEA

8D & T6s

FE/BE Interaction

Education

Bachelor's Degree in Engineering

Tools

SMT knowledge

Semiconductor packaging

Assembly & Test knowledge

Job description

Drive Technology Integration activities to ensure the package fulfill all requirements in the aspect of Process Interaction. Key working partner for FE colleagues for new FE technology.

Your role

Key responsibilities in your new role

• PBC and TPC assessment.
• Driver of Package Technology DFMEA Process of Record.
• Owner of Risk Interaction assessment and mitigation work packages.
• Integration of unit processes (BOM and Process) in package platform -Risk assessment, study interaction with other processes, process flow.
• Working partner for FE in FE/BE interaction and integration topics.
• Support Pre development for new Chip technology.

Your profile

Qualifications and skills to help you succeed

• Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 10 years of working experience in IC/semiconductor environment SMT, Semiconductor Packaging, Assembly and Test knowledge.
• Good aptitude for communication, collaboration, negotiation and solution finding.
• Knowledge of FE/BE and BE/BE Interaction.
• Knowledge of 8D & T6s methodology.
• Knowledge of DFMEA/PFMEA.
• Knowledge of Internal Package analysis/ first level reliability.

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Are you in?

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