Principal Engineer Unit Process Singulation

Infineon Technologies AG; Malacca; On-site; INR 1,200,000 - 2,000,000; Full time

Job summary

Infineon Technologies AG in India seeks a senior engineer for process development in package singulation and laser marking. You will lead advanced development projects, drive technology roadmaps, and mentor teams across sites, ensuring manufacturing readiness and IP stewardship.

The role requires deep hands-on expertise in tape-based and tapeless singulation, UV/IR laser processes, and collaboration with equipment suppliers to maintain competitive advantages.

Qualifications

• Minimum 12 years in semiconductor backend assembly and package development.
• Minimum 7 years direct experience in package singulation and laser marking process development.
• Hands-on experience in tape-based singulation, tapeless singulation, laser marking and singulation.
• Experience in high-volume semiconductor manufacturing environments.
• Proven track record in process development, industrialization, and yield improvement.
• Technical expertise in blade dicing, saw singulation, UV/IR lasers, stealth and advanced laser dicing technologies, multi-package and panel-level singulation.
• Experience with major singulation equipment suppliers and laser technology providers is a plus.
• Strong leadership, strategic thinking, analytical, and stakeholder management skills.

Responsibilities

• Lead or support technical handover and knowledge transfer to Operations.
• Drive AoK initiatives and act as technical expert across Infineon sites.
• Lead technical critical path activities for development projects.
• Collaborate with suppliers to drive IP ideas and continuous improvement.
• Develop and maintain Process Specifications, PFMEA, DFMEA, Master FMEA, and related docs.
• Provide mentorship to engineers and project teams.
• Define technology roadmaps and evaluate emerging technologies.

Skills

Semiconductor backend assembly

Package singulation

Laser marking

Tapeless & tape-based singulation

High-volume manufacturing

Technical leadership

Stakeholder management

Education

Bachelor's or Master's in Engineering

Tools

Blade dicing equipment

Saw singulation equipment

UV/IR laser systems

Job description

Build the future nobody's dreamed of yet...are you ready to rethink the impossible? Perform process development activities, including process parameter scouting, optimization, verification, and Process Freeze, within development projects to achieve targets in timeline, quality, cost competitiveness, and manufacturability.

Drive the qualification and implementation of tape-based singulation processes, tapeless singulation solutions, laser marking and singulation technologies, and hybrid singulation approaches. Lead or support technical handover and knowledge transfer activities to Operations. Generate, maintain, and update relevant technical documentation, including Process Specifications, PFMEA, DFMEA, Master FMEA, OJTI, T32, and PDR.

Support the build and evaluation of prototypes and development samples. Evaluate emerging singulation technologies and establish technology readiness for industrial deployment. Provide input for the creation and maintenance of related documentation and ensure content accuracy, including Process of Record, Assembly Design Rules, Process Roadmaps, Failure Catalogues, Control Plans, Maintenance Checklists, and Unit Process Roadmaps for development projects.

Collaborate with suppliers to drive continuous improvement initiatives and perform verification and qualification activities for new tooling, equipment, and materials within development projects. Identify and develop new process technologies while enhancing process capability to meet evolving business requirements. Benchmark industry best practices and identify opportunities to strengthen competitive advantages. Provide technical guidance and mentorship to engineers and project team members.

Initiate, develop, and drive intellectual property (IP) ideas through research and technology exploration. Stay abreast of emerging technologies to define and drive the direction of process technologies, materials, equipment, and tooling solutions. Serve as the Area of Knowledge (AoK) consultant across sites and globally within Infineon, acting as a multiplier within the Technical Ladder (TL) community. Lead technical critical path activities for development projects and AoK-related initiatives across sites. Act as the primary technical expert in package singulation technology, driving the development of next-generation, high-performance, cost-effective, and scalable semiconductor packaging solutions.

Master's or Bachelor's Degree in Engineering or a related discipline. Minimum 12 years of experience in semiconductor backend assembly and package development. Minimum 7 years of direct experience in package singulation and laser marking process development. Proven hands-on expertise in tape-based singulation, tapeless singulation, laser marking and singulation. Experience supporting high-volume semiconductor manufacturing environments. Demonstrated track record in process development, industrialization, and yield improvement. Technical expertise in various singulation technologies, including blade dicing and saw singulation, tape-based package singulation, tapeless package handling and singulation, UV and IR laser processes, stealth and advanced laser dicing technologies, and multi-package and panel-level singulation strategies. Experience working with major singulation equipment suppliers and laser technology providers is an added advantage. Strong technical leadership skills with the ability to influence without direct authority. Strategic thinking capability with experience in technology roadmap planning. Excellent analytical and problem-solving skills. Strong stakeholder management, communication, and interpersonal skills.

We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience.