Pcb Design Engineer

Tessolve; Bengaluru; On-site; INR 900,000 - 1,300,000; Full time

Job summary

Tessolve is seeking a PCB Design Engineer in Bengaluru to lead multi-layer PCB layout for high-speed, high-power electronics. The role requires Cadence Allegro proficiency, strong SI/PI knowledge, and collaboration with hardware, mechanical, and manufacturing teams to ensure reliable, manufacturable designs.

You'll contribute to HDI stack-ups, Gerber releases, and design reviews while ensuring signal integrity and manufacturability throughout the development cycle. 4+ years experience preferred.

Qualifications

• Proficient in Cadence Allegro for schematic capture and PCB layout.
• Experience with DDR memory layouts and high-power design.
• Knowledge of PCB fabrication, assembly, DFM and DFA best practices.

Responsibilities

• Design multilayer PCBs for high-speed, high-power, mixed-signal applications.
• Perform placement and routing to meet SI/PI and manufacturability needs.
• Generate Gerber outputs, manufacturing and assembly packages.
• Collaborate with hardware, mechanical and manufacturing teams.
• Plan stack-ups and HDI techniques including blind/buried vias.
• Support library development, schematic capture, layout and Gerber release.
• Interpret mechanical constraints and manufacturing requirements for robust boards.

Skills

Cadence Allegro

DDR layouts

HDI PCB techniques

Signal integrity

Education

Diploma/BSc in ECE/EEE/EIE

Tools

Cadence Allegro

Job description

About Us:

Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3200+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs.

Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolves design services include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP, and foundries. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others. Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial and Medical segments. Tessolves Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities.

Tessolves clientele includes Tier 1 clients across multiple market segments, 9 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence over 12 countries with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, Canada, UK, Japan, Taiwan, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose.

For more details, visit https://www.tessolve.com/

Job Overview

This PCB Design Engineer role leads multilayer PCB layout and release for high-speed, high-power, and mixed-signal electronic products in the electronics/hardware industry. The position requires strong Cadence Allegro skills, PCB fabrication and assembly knowledge, and collaboration with hardware, mechanical, SI/PI, and manufacturing teams to ensure signal and power integrity, manufacturability, and reliable product delivery within the development cycle.

Job Designation: PCB Design Engineer

Years of Exp: 4+ Years Experience

Job Location: Bangalore

What you'll do

• Design multilayer PCBs for high-speed, high-power, and mixed-signal applications.
• Perform PCB placement and routing meeting SI, PI, manufacturability, and reliability needs.
• Generate fabrication, assembly, and manufacturing outputs including Gerber release packages.
• Conduct design reviews and resolve layout-related technical issues with stakeholders.
• Collaborate with hardware, mechanical, SI/PI, and manufacturing teams throughout development.
• Plan multilayer stack-ups and implement HDI techniques including blind, buried, microvias.
• Support library development, schematic capture, layout design, and Gerber generation and release.
• Interpret mechanical constraints and manufacturing requirements for robust board designs.

Who you are

• Holder of a diploma or bachelors in ECE, EEE, EIE, or related field.
• Skilled user of Cadence Allegro for schematic capture and PCB layout tasks.
• Experienced in DDR memory layouts, high-power design, and HDI PCB techniques.
• Knowledgeable about PCB fabrication, assembly, DFM, DFA, and best design practices.
• Familiar with signal integrity and power integrity design considerations.
• Comfortable working with PCB fabrication and assembly vendors and stakeholders.
• Strong communicator who collaborates effectively across cross-functional teams.
• Analytical, detail-oriented, organized, and able to manage multiple project schedules