Background
Functional reporting to Leadership, R&D – Electronics
i) Educational Qualification
Essential: B.E/ B Tech in Electrical/Electronics, M Tech in Electrical/Electronics is preferred; Min. 70% score required at all levels of education
ii) Experience
Minimum: 5
Maximum: 12
iii) Age Limit
Minimum: 24
Maximum: 35
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Job Role & Responsibilities
Technical/ Functional:
- PCB Layout Design for Power Electronics:
- Design multi-layer PCBs for high-power motor controllers, DC-DC converters, inverters, and battery management systems (BMS).
- Optimize power planes, creepage & clearance distances, and thermal dissipation for high-voltage (>96V) and high-current applications.
- Ensure low-inductance routing, controlled impedance, and effective grounding strategies for high-power circuits.
- Select appropriate PCB materials (FR4, Rogers, Polyimide, etc.) for highreliability applications.
- Implement EMI/EMC best practices, including shielding, filtering, and differential pair routing.
- PCB Layout for High-Speed Digital and Communication:
- Design PCBs for RF modules, antennas, and high-speed signal transmission (GHz range).
- Implement microstrip, stripline, coplanar waveguides, and controlled impedance routing.
- Optimize layouts for minimum crosstalk, reflection, and insertion loss.
- Work closely with RF engineers for layout optimization, grounding, and signal integrity enhancements.
- Conduct EMI simulations and compliance testing to meet RF regulatory standards.
- PCB Layout for Analog & Mixed-Signal Circuits:
- Design low-noise, precision analog circuit layouts, including op-amps, ADCs, DACs, and sensor interfaces.
- Implement star-grounding, guard rings, and Kelvin sensing techniques for ultra-low- noise performance.
- Optimize high-precision data acquisition and mixed-signal PCB layouts.
- Ensure minimized parasitic capacitance and inductance in sensitive analog circuits.
- Thermal & Mechanical Considerations:
- Design thermal vias, heat sinks, copper pours, and metal core PCBs (MCPCB) for high-power applications.
- Work closely with mechanical engineers to optimize PCB integration within enclosures and cooling solutions.
- Work closely with CFTs to perform thermal simulations and power dissipation analysis for PCB heat management.
5. Design Validation & Compliance:
- Perform DFM (Design for Manufacturability), DFA (Design for Assembly), and DFT (Design for Testability) analysis.
- Conduct PCB design reviews and ensure adherence to design guidelines, EMI/EMC requirements, manufacturability, and reliability standards.
- Collaborate with fabrication and assembly vendors to ensure high-yield production.
- Ensure compliance with IPC standards (IPC-2221, IPC-600, IPC-6012), EMI/EMC regulations, and automotive/industrial safety norms.
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Competency Requirements
Behavioural:
- Strong ownership mindset with the ability to independently drive PCB development activities.
- Hands-on problem-solving approach with high attention to detail.
- Excellent communication and stakeholder management skills.
- Strong collaboration skills across cross-functional teams.
- Ability to anticipate challenges and proactively drive solutions.
- Quality-first mindset focused on robust and reliable designs.
- Innovative and continuous improvement mindset with the ability to translate concepts into practical solutions.
Specific expertise required for functional area:
- Proficiency in PCB design tools such as Altium Designer, Cadence and Allegro/OrCAD. Hands-on expertise in Altium Designer preferred.
- Expertise in multilayer PCB design, stack-up definition, routing optimization, design rule management, and PCB release processes.
- Experience in power electronics PCB design, including high-voltage and high-current layouts, creepage and clearance requirements, thermal management, and safety compliance.
- Strong knowledge of analog, digital, and mixed-signal PCB layout, including low-noise routing, grounding strategies, signal integrity, and EMI/EMC mitigation techniques.
- Experience in RF and high-speed PCB design, controlled impedance routing, differential pair routing, shielding, SI/PI considerations, and high-frequency layout practices.
- Knowledge of DFM, DFA, and DFT principles, PCB fabrication technologies, assembly processes, and design optimization for manufacturability and reliability.
- Understanding of advanced PCB technologies such as HDI, Flex PCB, RigidFlex PCB, and Metal Core PCB (MCPCB).
- Experience with simulation and analysis tools such as Ansys SIwave, HyperLynx, LTspice, CST Studio Suite, and Keysight ADS for signal integrity, power integrity, thermal, and RF analysis.
- Familiarity with automotive standards and requirements related to PCB design, including EMI/EMC, environmental robustness, reliability, and product qualification requirements.
- Experience supporting PCB-related failure analysis, design reviews, prototype builds, validation activities, and manufacturing issue resolution.
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Likely Sources
Bosch, Harman, Philips, Havells, Aptiv, Tata Electronics, Foxconn, Flex Ltd., Jabil,