IC Package Development Engineer

Micron Technology, Inc.; Telangana; On-site; INR 900,000 - 1,200,000; Full time

Job summary

Micron Technology, Inc. in Telangana, India, invites engineers to join Package Development & Engineering. The role encompasses feasibility studies, design optimization, and process qualification for memory packaging technologies.

You will collaborate with global teams to resolve manufacturability and data-quality issues while applying CAD/EDA tools and AI/ML automation. The position requires a strong foundation in engineering mathematics, physics, and data interpretation, plus programming in

Qualifications

• Strong foundation in engineering mathematics and physics.
• Ability to learn semiconductor packaging concepts and manufacturing processes.
• Programming or scripting exposure in Python, MATLAB, C/C++.
• Ability to communicate clearly and collaborate across functions.

Responsibilities

• Support package feasibility studies, architecture evaluations, design optimization, and risk assessments.
• Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package engineering.
• Support development activities for memory and semiconductor package technologies from concept through qualification and manufacturing readiness.
• Analyze engineering data, identify risks, document findings, and recommend actions.

Skills

Python

MATLAB

C/C++

Data interpretation

Problem solving

Communication

Education

Bachelor's or master's degree in Mechanical Engineering

Bachelor's or master's degree in Electrical Engineering

Bachelor's or master's degree in Electronics Engineering

Bachelor's or master's degree in Mechatronics

Bachelor's or master's degree in Materials Engineering

Bachelor's or master's degree in Semiconductor Engineering

Bachelor's or master's degree in Computer Science

Bachelor's or master's degree in Data Science

Tools

CAD/EDA tools

Teamcenter

Job description

JR105692

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Package Development & Engineering

• Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments.
• Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems.
• Support development activities for memory and semiconductor package technologies from concept through qualification and manufacturing readiness.
• Analyze engineering data, identify risks, document findings, and recommend technically sound actions.
• Contribute to design-for-manufacturing, design-for-reliability, design quality, and first-pass qualification objectives.

Design, CAD & EDA

• Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, design inputs, and engineering deliverables.
• Use CAD/EDA tools to support physical design, routing, logical design, design-rule validation, documentation, and release activities.
• Work with multidisciplinary teams to resolve design, manufacturability, performance, and data-quality issues.
• Support engineering standards, reusable design methods, templates, and best-known methods.

AI, ML & Automation

• Develop automation for repetitive design, simulation, data-processing, validation, reporting, and engineering workflow activities.
• Build or contribute to AI/ML models for design validation, optimization, prediction, anomaly detection, and simulation acceleration.
• Create engineering assistants, copilot agents, dashboards, and data pipelines that improve decision speed and traceability.
• Translate engineering challenges into scalable digital solutions with appropriate validation, documentation, security, and human oversight.
• Measure solution effectiveness using clear engineering, quality, adoption, and cycle-time indicators.

Collaboration & Execution

• Work effectively with global teams across PDE, product engineering, technology development, manufacturing, quality, suppliers, and business stakeholders.
• Communicate technical information clearly through analyses, presentations, design reviews, and engineering documentation.
• Participate in training, rotational assignments, mentoring, technical reviews, and continuous improvement initiatives.
• Demonstrate ownership, learning agility, disciplined execution, and commitment to safe and ethical engineering practices.

Minimum Qualifications

• Bachelor's or master's degree in mechanical engineering, Electrical Engineering, Electronics Engineering, Mechatronics, Materials Engineering, Semiconductor Engineering, Computer Science, Data Science, or a closely related discipline.
• Strong foundation in engineering mathematics, physics, problem solving, and data interpretation.
• Ability to learn semiconductor packaging concepts, design methods, manufacturing processes, and engineering systems.
• Programming or scripting exposure in Python, MATLAB, C/C++, or equivalent language.
• Ability to communicate clearly, collaborate across functions, and manage assigned work with discipline.

Preferred Qualifications and Differentiators

• Semiconductor packaging exposure
• Simulation exposure
• Experience working on AI/ML solutions
• Strong generative AI usage
• Data analytics and visualization
• PLM/ALM exposure, including Teamcenter, change management, and master data

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational…