IC Package Development Engineer

Micron Technology, Inc

Hyderabad

On-site

INR 900,000 - 1,300,000

Full time

14 days+
Application generator

Turn this role into an interview — a resume and cover letter built around what this employer wants.

Get past ATS filters

Job summary

Micron Technology, Inc. is seeking a Semiconductor Design Engineer 2 to support package feasibility, architecture, and design optimization across mechanical, electrical, and materials domains.

The role covers development from concept through qualification and manufacturing readiness, with emphasis on data-driven risk assessment and design-for-manufacturing principles. You will collaborate with PDE, product engineering, and manufacturing teams to resolve design issues, contribute to engineering

Qualifications

  • Solid foundation in engineering mathematics, physics, and data interpretation.
  • Proficient in programming or scripting with Python, MATLAB, or C/C++.
  • Strong communication and collaboration across functions.

Responsibilities

  • Support package feasibility studies, architecture evaluations, design optimization, and risk assessments.
  • Apply fundamentals across mechanical, electrical, materials, thermal, and manufacturing disciplines.
  • Support development for memory and semiconductor package technologies from concept to manufacturing readiness.
  • Analyze data, identify risks, document findings, and recommend actions.
  • Contribute to design-for-manufacturing/reliability/quality and first-pass qualification.

Skills

Engineering mathematics
Physics
Problem solving
Data interpretation
Python
MATLAB
C/C++
Communication
Collaboration

Education

Bachelor's or master's degree in Mechanical Engineering or Electrical/Electronics/Mechatronics/Materials/Semiconductor/CS/Data Science

Tools

Teamcenter

Job description

Key Responsibilities

Package Development & Engineering


  • Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments.

  • Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems.

  • Support development activities for memory and semiconductor package technologies from concept through qualification and manufacturing readiness.

  • Analyze engineering data, identify risks, document findings, and recommend technically sound actions.

  • Contribute to design-for-manufacturing, design-for-reliability, design quality, and first-pass qualification objectives.


Design, CAD & EDA


  • Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, design inputs, and engineering deliverables.

  • Use CAD/EDA tools to support physical design, routing, logical design, design-rule validation, documentation, and release activities.

  • Work with multidisciplinary teams to resolve design, manufacturability, performance, and data-quality issues.

  • Support engineering standards, reusable design methods, templates, and best-known methods.


AI, ML & Automation


  • Develop automation for repetitive design, simulation, data-processing, validation, reporting, and engineering workflow activities.

  • Build or contribute to AI/ML models for design validation, optimization, prediction, anomaly detection, and simulation acceleration.

  • Create engineering assistants, copilot agents, dashboards, and data pipelines that improve decision speed and traceability.

  • Translate engineering challenges into scalable digital solutions with appropriate validation, documentation, security, and human oversight.

  • Measure solution effectiveness using clear engineering, quality, adoption, and cycle-time indicators.


Collaboration & Execution


  • Work effectively with global teams across PDE, product engineering, technology development, manufacturing, quality, suppliers, and business stakeholders.

  • Communicate technical information clearly through analyses, presentations, design reviews, and engineering documentation.

  • Participate in training, rotational assignments, mentoring, technical reviews, and continuous improvement initiatives.

  • Demonstrate ownership, learning agility, disciplined execution, and commitment to safe and ethical engineering practices.


Minimum Qualifications


  • Bachelor's or master's degree in mechanical engineering, Electrical Engineering, Electronics Engineering, Mechatronics, Materials Engineering, Semiconductor Engineering, Computer Science, Data Science, or a closely related discipline.

  • Strong foundation in engineering mathematics, physics, problem solving, and data interpretation.

  • Ability to learn semiconductor packaging concepts, design methods, manufacturing processes, and engineering systems.

  • Programming or scripting exposure in Python, MATLAB, C/C++, or equivalent language.

  • Ability to communicate clearly, collaborate across functions, and manage assigned work with discipline.


Preferred Qualifications and Differentiators


  • Semiconductor packaging exposure

  • Simulation exposure

  • Experience working on AI/ML solutions

  • Strong generative AI usage

  • Data analytics and visualization

  • PLM/ALM exposure, including Teamcenter, change management, and master data


Job Profile(s)

Semiconductor Design Engineer 2


Relocation level: (TBD)


As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc


Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Senior Engineer/ Engineer – Package Silicon Integration Engineer Hyderabad, Telangana, India Posted a day ago
Senior Engineer/ Engineer – Package Silicon Integration Engineer Hyderabad, Telangana, India Posted a day ago

Micron Technology, Inc • Hyderabad

On-site
INR 2,500,000 - 4,000,000
Medical, dental, vision plans
Paid time off & holidays
Equal opportunity employer
Engineer/Associate Engineer – AI & Automation Engineer
Engineer/Associate Engineer – AI & Automation Engineer

Micron Technology, Inc • Hyderabad

On-site
INR 1,200,000 - 2,400,000
Engineer – PDE Process Control Systems
Engineer – PDE Process Control Systems

Micron Technology, Inc • Hyderabad

On-site
INR 1,500,000 - 2,700,000
Semiconductor Package Electrical Engineer
Semiconductor Package Electrical Engineer

Micron Technology, Inc. • Hyderabad

On-site
INR 900,000 - 1,500,000
Mechanical Simulation Engineer – Advanced Packaging
Mechanical Simulation Engineer – Advanced Packaging

Micron Technology, Inc • Hyderabad

On-site
INR 1,200,000 - 2,300,000
Medical, dental, vision plans
Paid time off
Flexible benefits
Senior Engineer/ Engineer – PDE Process Control Systems
Senior Engineer/ Engineer – PDE Process Control Systems

Micron Technology, Inc • Hyderabad

On-site
INR 1,800,000 - 3,000,000
Senior Engineer – PDE Process Control Systems
Senior Engineer – PDE Process Control Systems

Micron Technology, Inc • Hyderabad

On-site
INR 2,500,000 - 4,500,000
Medical, dental and vision plans
Paid time off
Engineer – PDE Process Control Systems Hyderabad, Telangana, India
Engineer – PDE Process Control Systems Hyderabad, Telangana, India

Micron Technology, Inc • Hyderabad

On-site
INR 1,200,000 - 1,800,000
Medical, dental and vision plans
Paid time-off and holidays
Relocation assistance
Design Methodology – Principal DRAM Power Integrity Engineer
Design Methodology – Principal DRAM Power Integrity Engineer

Micron Technology, Inc • Hyderabad

On-site
INR 800,000 - 1,500,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program
Program Manager – Chip Design
Program Manager – Chip Design

Micron Technology, Inc • Hyderabad

On-site
INR 4,000,000 - 7,000,000