IC Package Development Engineer

1840 Micron Tech. OP India LLP

Hyderabad

On-site

INR 1,500,000 - 2,100,000

Full time

14 days+
Application generator

Get a reply from this employer — a resume and cover letter tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

Micron Technology, Inc. in Hyderabad, India is seeking a packaging engineer to drive development across feasibility, design optimization, and manufacturing readiness.

You will apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to solve complex packaging challenges. You will work with multidisciplinary teams, use CAD/EDA tools, and contribute to design-for-manufacturing, design-for-reliability, and design-quality objectives while collaborating across PDE, product

Qualifications

  • Strong foundation in engineering mathematics, physics, problem solving, and data interpretation.
  • Programming or scripting exposure in Python, MATLAB, C/C++, or equivalent language.
  • Ability to learn semiconductor packaging concepts, design methods, manufacturing processes, and engineering systems.

Responsibilities

  • Package development and engineering support across feasibility studies, architecture evaluations, design optimization, and risk assessments.
  • Design, CAD & EDA: create/review package layouts, substrate structures, stack-ups, drawings, inputs, and engineering deliverables.
  • AI, ML & Automation: develop automation for repetitive design, simulation, data processing, validation, and reporting.
  • Collaboration & Execution: work with global teams and communicate analyses, reviews, and documentation.

Skills

Mathematics
Problem solving
Data interpretation
Communication

Education

Engineering degree (mechanical, electrical, electronics, mechatronics, materials, semiconductor)
Computer Science or Data Science degree

Tools

Python
MATLAB
C/C++
Teamcenter

Job description

Key Responsibilities

Package Development & Engineering Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments. Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems. Support development activities for memory and semiconductor package technologies from concept through qualification and manufacturing readiness. Analyze engineering data, identify risks, document findings, and recommend technically sound actions. Contribute to design-for-manufacturing, design-for-reliability, design quality, and first-pass qualification objectives.

Design, CAD & EDA Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, design inputs, and engineering deliverables. Use CAD/EDA tools to support physical design, routing, logical design, design-rule validation, documentation, and release activities. Work with multidisciplinary teams to resolve design, manufacturability, performance, and data-quality issues. Support engineering standards, reusable design methods, templates, and best-known methods.

AI, ML & Automation Develop automation for repetitive design, simulation, data-processing, validation, reporting, and engineering workflow activities. Build or contribute to AI/ML models for design validation, optimization, prediction, anomaly detection, and simulation acceleration. Create engineering assistants, copilot agents, dashboards, and data pipelines that improve decision speed and traceability. Translate engineering challenges into scalable digital solutions with appropriate validation, documentation, security, and human oversight. Measure solution effectiveness using clear engineering, quality, adoption, and cycle-time indicators.

Collaboration & Execution Work effectively with global teams across PDE, product engineering, technology development, manufacturing, quality, suppliers, and business stakeholders. Communicate technical information clearly through analyses, presentations, design reviews, and engineering documentation. Participate in training, rotational assignments, mentoring, technical reviews, and continuous improvement initiatives. Demonstrate ownership, learning agility, disciplined execution, and commitment to safe and ethical engineering practices.

Minimum Qualifications
  • Bachelor's or master's degree in mechanical engineering, Electrical Engineering, Electronics Engineering, Mechatronics, Materials Engineering, Semiconductor Engineering, Computer Science, Data Science, or a closely related discipline.
  • Strong foundation in engineering mathematics, physics, problem solving, and data interpretation.
  • Ability to learn semiconductor packaging concepts, design methods, manufacturing processes, and engineering systems.
  • Programming or scripting exposure in Python, MATLAB, C/C++, or equivalent language.
  • Ability to communicate clearly, collaborate across functions, and manage assigned work with discipline.
Preferred Qualifications and Differentiators
  • Semiconductor packaging exposure
  • Simulation exposure
  • Experience working on AI/ML solutions
  • Strong generative AI usage
  • Data analytics and visualization
  • PLM/ALM exposure, including Teamcenter, change management, and master data
About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

IC Package Development Engineer
IC Package Development Engineer

micron • Hyderabad

On-site
INR 1,200,000 - 2,100,000
Mechanical Simulation Engineer - Advanced Packaging
Mechanical Simulation Engineer - Advanced Packaging

micron • Hyderabad

On-site
INR 900,000 - 1,500,000
Semiconductor Package Electrical Engineer
Semiconductor Package Electrical Engineer

Micron Technology • Hyderabad

On-site
INR 900,000 - 1,500,000
Semiconductor Package Electrical Engineer
Semiconductor Package Electrical Engineer

1840 Micron Tech. OP India LLP • Hyderabad

On-site
INR 1,800,000 - 2,600,000
Senior Engineer/ Engineer – Package Silicon Integration Engineer
Senior Engineer/ Engineer – Package Silicon Integration Engineer

Micron Technology • Hyderabad

On-site
INR 1,500,000 - 3,000,000
Senior Engineer/ Engineer – Package Silicon Integration Engineer
Senior Engineer/ Engineer – Package Silicon Integration Engineer

Micron Technology, Inc • Hyderabad

On-site
INR 1,500,000 - 2,000,000
IC Package Development Engineer
IC Package Development Engineer

Micron Technology, Inc • Hyderabad

On-site
INR 900,000 - 1,300,000
Mechanical Simulation Engineer – Advanced Packaging
Mechanical Simulation Engineer – Advanced Packaging

Micron Technology • Hyderabad

On-site
INR 1,200,000 - 2,200,000
Sr. Engineer, TSE-SIG, Mechanical
Sr. Engineer, TSE-SIG, Mechanical

Micron • Hyderabad

On-site
INR 2,500,000 - 4,200,000
Sr. Engineer, TSE-SIG, Mechanical
Sr. Engineer, TSE-SIG, Mechanical

Micron Technology • Hyderabad

On-site
INR 1,800,000 - 3,000,000