Mechanical Simulation Engineer – Advanced Packaging

Micron Technology, Inc; Hyderabad; On-site; INR 1,200,000 - 2,300,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

Flexible benefits

Job summary

Micron Technology, Inc. is seeking a Mechanical Simulation Engineer to drive thermo‑mechanical and multiphysics modeling for advanced semiconductor packaging technologies such as HBM, 2.5D and 3D integration.

The role emphasizes integrating Generative AI and AI Assistant tools to optimize workflows, improve accuracy, and reduce cycle time. You will collaborate with cross‑functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation

Qualifications

• 2-5 years of experience in Mechanical/Materials engineering within semiconductor or advanced packaging.
• Experience in AI-driven modeling, automation, or data-driven simulation techniques preferred.

Responsibilities

• Perform linear and non-linear static analysis for package and material behavior
• Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages
• Develop multiphysics models (thermo-mechanical, thermal, structural, fluidic)
• Model interfaces including contact, shear, delamination, and interfacial damage
• Integrate Generative AI and AI Assistant tools to accelerate and optimize simulations
• Apply AI/ML techniques for surrogate modeling, reduced-order modeling, and design optimization
• Develop and deploy automation workflows for simulation setup, solve, and post-processing
• Leverage data-driven methods to enhance model fidelity and reduce turnaround time
• Support development of HBM, 2.5D/3D packages, TSV, and hybrid bonding technologies
• Understand fabrication and assembly processes such as thermo-compression bonding, reflow, and wafer bonding
• Develop material models for polymers, composites, and thin-film stacks
• Drive material characterization workflows and validation
• Perform failure and reliability analysis including fatigue life and crack propagation
• Collaborate with global cross-functional teams

Job description

Req. ID: JR105342 Mechanical Simulation Engineer – Advanced Packaging

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Mechanical Simulation Engineer, you will drive thermo‑mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross‑functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions.

Job Responsibilities

• Perform linear and non‑linear static analysis for package and material behavior


• Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages


• Develop multiphysics models (thermo‑mechanical, thermal, structural, fluidic)


• Model interfaces including contact, shear, delamination, and interfacial damage


• Integrate Generative AI, AI Assistant tools, and Artificial Intelligence for simulation acceleration and optimization


• Apply AI/ML techniques for surrogate modeling, reduced‑order modeling, and design optimization


• Develop and deploy automation workflows for simulation setup, solve, and post‑processing


• Leverage data‑driven methods to enhance model fidelity and reduce turnaround time


• Support development of HBM, 2.5D/3D packages, TSV, and hybrid bonding technologies


• Understand fabrication and assembly processes such as thermo‑compression bonding, reflow, and wafer bonding


• Develop material models for polymers, composites, and thin‑film stacks


• Drive material characterization workflows and validation


• Perform failure and reliability analysis including fatigue life and crack propagation


• Collaborate with global cross‑functional teams

Experience

2-5 years of experience in Mechanical/Materials engineering within semiconductor or advanced packaging domains, with experience in AI‑driven modeling, automation, or data‑driven simulation techniques preferred.

Job Profile(s)

Semiconductor Design Engineer 2

Relocation level: (TBD)

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.