Senior Engineer/ Engineer – Package Silicon Integration Engineer

Micron Technology; Hyderabad; On-site; INR 1,500,000 - 3,000,000; Full time

Job summary

Micron Technology is seeking specialists in IC packaging and CPI-aware integration to drive design rules and reliable packaging solutions. You will collaborate across silicon, package, and lab teams to develop test vehicles and validate CPI behaviours using simulation-informed DOEs.

Qualifications include MS/PhD in relevant fields and experience in BEOL integration, thermal/electrical modeling, and cross‑functional teamwork.

Qualifications

• Experience with IC package development and CPI concepts.
• Ability to design and conduct DOEs informed by simulations.
• Experience with virtual prototyping or simulation tools.
• Knowledge of FEA, thermal or electrical/signal integrity modeling.

Responsibilities

• Define mechanical characterization architectures for CPI behaviors.
• Plan and execute DOEs to validate integration approaches.
• Collaborate with silicon, package, and lab SMEs.
• Guide design rule development and manufacturability improvements.
• Partner with global teams to resolve integration challenges.

Skills

IC package development

CPI concepts

DOE planning

Test vehicle development

Front-end BEOL integration

Cross-functional collaboration

Education

MS/PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or Microelectronics

PhD strongly preferred; hands-on industry experience considered

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Roles & responsibilities can include but are not limited to:

• Technology Integration
  • Understand silicon and package technology roadmaps across market segments and identify integration solutions that address business needs.
  • Develop and execute plans to integrate new silicon technologies with new package platforms for memory applications, with a focus on identifying and resolving CPI issues.
  • Guide technology development through various maturity phases, supporting Micron's goals of technology leadership and manufacturing excellence.
• Virtual Prototyping & Simulation Support
  • Contribute to virtual prototyping and artificial intelligence workflows that evaluate new materials, structures, and integration schemes before committing to physical builds — reducing time‑to‑learning and build costs.
  • Apply or develop working knowledge of multi‑physics simulation (mechanical, thermal, or electrical) to support CPI risk assessment and integration decisions.
  • Use virtual prototyping insights to inform test vehicle scope, helping to down‑select build options and focus empirical effort on highest-risk scenarios.
  • Correlate simulation outputs with physical characterization, package build data, and reliability results to improve predictive confidence — with support from dedicated simulation specialists where needed.
• Characterization & Qualification
  • Define mechanical characterization architectures that efficiently capture CPI behaviors and validate integration assumptions across technology nodes in collaboration with silicon, package, and lab subject matter experts for characterization of critical integration parameters.
  • Plan and execute Design of Experiments (DOEs) informed by both simulation predictions and test vehicle results to efficiently validate integration approaches.
  • Characterize enabling technologies across thermal, mechanical, electrical, and reliability dimensions and document best‑known processes (BKMs) and transition validated learnings into manufacturing‑ready processes and design rules.
  • Hand‑off validated material selections, process guidelines, and design rules to manufacturing teams in a structured and repeatable manner.
• Design Rule Development
  • Collaborate with silicon and package developers to identify solutions and implement design rules informed by both empirical and simulation‑based insights.
  • Contribute to stack‑up guidance and layout recommendations that improve reliability and manufacturability.
  • Translate learnings from characterizations and virtual prototypes into actionable design guidelines for silicon and package design teams.
• Cross‑Functional Collaboration
  • Partner with global R&D (Research & Development), wafer fabs, and manufacturing packaging teams to resolve integration challenges and improve yield, quality, and manufacturability.
  • Support root cause analysis efforts by combining physical failure analysis with test vehicle data and available simulation insights.
  • Engage with silicon design, package design, and test teams to align test vehicle objectives and virtual prototyping priorities with program needs.
• Roadmap Alignment
  • Stay aligned with evolving silicon and package technology roadmaps (e.g., 3DS, HBM, advanced node scaling) to anticipate integration challenges and plan accordingly.
  • Identify gaps in test methodology coverage and virtual prototyping capabilities to support next‑generation technology enablement.

Mandatory Requirements

• Understanding of IC package development with exposure to CPI concepts, test vehicle development, front‑end fab processes, or BEOL integration.
• Ability to define and execute test vehicle strategies that efficiently characterize integration behaviors and accelerate technology maturity.
• Familiarity with virtual prototyping concepts and the use of simulation to reduce physical build dependency is a strong plus.
• Familiarity with at least one simulation or modeling domain is advantageous but not required:
  • Mechanical stress / thermo‑mechanical analysis (FEA)
  • Thermal simulation
  • Electrical / signal integrity / power integrity modeling
• Background in fab metallization, BEOL (Back End of Line) integration, or front‑end fab interactions is preferred.
• Ability in translating test vehicle and simulation data into DOE decisions and design rules.
• Experience with cross‑functional project coordination and technical collaboration across global teams.
• Strong analytical and problem‑solving skills with the ability to translate data into actionable integration decisions.
• Strong interpersonal, oral, and written English communication skills.

Additional/Preferred Qualifications

• Experience with AI/ML tools for data visualization/automation.
• Knowledge of semiconductor fabrication, assembly & test processes.

Education Qualifications

• M.S. or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or Microelectronics with less than 2 years’ experience is preferred
• Ph.D. is strongly preferred but not required; relevant hands‑on industry experience will be equally considered.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high‑performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

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