Flip Chip Technician

Tata Electronics; Assam; On-site; INR 600,000 - 1,200,000; Full time

Job summary

Tata Electronics in Assam, India, seeks an experienced engineer to drive technology and process development for Flip Chip packaging. You will lead FOL and EOL steps, optimize yield and quality, and push for cost-competitive DFM solutions.

You will engage vendors, help select 4Ms, install and qualify processes for development, NPI and LVM, and champion continuous improvements across multiple projects.

Responsibilities

• Responsible for the technology and process development for the Flip Chip product packaging.
• FOL: Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill.
• EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing.
• Understand, integrate and innovate to meet customers’ packaging requirements into a cost competitive DFM solution.
• Initiate and engage in technical discussions with vendors to gather all relevant data, review and complete the initial analysis for final decision submission.
• Involvement in the selection of 4Ms based on latest performance and previous experience/learnings.
• Install, buy-off and qualify the given processes and products for development, NPI and LVM.
• Continuously strive for meeting the highest degree of packaging difficulty, ease of DFM to meet best customer desired outputs, best in class yield, best quality in the industry.
• Offer a wide range of BOM selection to cater to different customer requirements.
• Execution of multiple department projects.
• Identify all process controls requirements and use the BKM for inputs & outputs data gathering/controls.
• Assist in the MES, Automation of material, process and recipe controls.

Job description

Job Description:

1. Responsible forthe technology and process development for the Flip Chip product packagingeg
2. FOL: Back grinding, Laser groove, Mechanical sawing,SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfilland
3. EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing.
4. Understand,integrateand innovate to meetcustomers’packagingrequirementsinto a cost competitiveDFMsolution.
5. Initiateand engage intechnical discussion with vendorsto gatherall relevant data, review and complete theinitialanalysisfor final decisionsubmission.
6. Involvement in theselectionof4Msbased on latest performance andpreviousexperience/learnings.
7. Install, buy-offand qualifythe givenprocessesand productsfor development, NPI and LVM.
8. Continuous Strive for meeting highest degree of packaging difficulty, ease of DFM to meet BEST customer desired outputs, best in class Yield, best Quality in the industry.
9. Offerwiderange of BOM selection tocater todifferent customerrequirement.
10. Execution of multiple department projects.
11. Identifyall process controlsrequirements and usethe BKM forinputs & outputsdata gathering/controls.
12. Assistin the MES,Automation of material,processand recipe controls.

Requirements: