Flip Chip Technician

Tata Electronics; Mayang; On-site; INR 600,000 - 900,000; Full time

Job summary

Tata Electronics in India is seeking a packaging technology engineer to lead Flip Chip packaging process development and related DFM solutions. You will drive NPI, LVM readiness, and collaborate with vendors on data gathering, process qualification, and BOM optimization.

The role covers installation and qualification of processes, ensuring high yield and best-in-class quality across multiple projects, with emphasis on MES and automation support.

Qualifications

• Understand, integrate and innovate to meet customers’ packaging requirements into a cost competitive DFM solution.
• Initiate and engage in technical discussion with vendors to gather data, review and complete the initial analysis for final decision submission.
• Involvement in the selection of 4Ms based on latest performance and previous experience/learnings.
• Install, buy-off and qualify the given processes and products for development, NPI and LVM.

Responsibilities

• FOL: Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill and EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing.
• Understand, integrate and innovate to meet customers’ packaging requirements into a cost competitive DFM solution.
• Initiate and engage in technical discussion with vendors to gather all relevant data, review and complete the initial analysis for final decision submission.
• Involvement in the selection of 4Ms based on latest performance and previous experience/learnings.
• Install, buy-off and qualify the given processes and products for development, NPI and LVM.
• Continuous Strive for meeting highest degree of packaging difficulty, ease of DFM to meet BEST customer desired outputs, best in class Yield, best Quality in the industry.
• Offer wide range of BOM selection to cater to different customer requirement.
• Execution of multiple department projects.
• Identify all process controls requirements and use the BKM for inputs & outputs data gathering/controls.
• Assist in the MES, Automation of material, process and recipe controls.

Skills

Process development

DFM

Vendor discussions

NPI

MES knowledge

Automation

Job description

• Responsible for the technology and process development for the Flip Chip product packaging eg

• Responsible for the technology and process development for the Flip Chip product packaging eg

FOL: Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill and EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing.

• Understand, integrate and innovate to meet customers’ packaging requirements into a cost competitive DFM solution.
• Initiate and engage in technical discussion with vendors to gather all relevant data, review and complete the initial analysis for final decision submission.
• Involvement in the selection of 4Ms based on latest performance and previous experience/learnings.
• Install, buy-off and qualify the given processes and products for development, NPI and LVM.
• Continuous Strive for meeting highest degree of packaging difficulty, ease of DFM to meet BEST customer desired outputs, best in class Yield, best Quality in the industry.
• Offer wide range of BOM selection to cater to different customer requirement.
• Execution of multiple department projects.
• Identify all process controls requirements and use the BKM for inputs & outputs data gathering/controls.
• Assist in the MES, Automation of material, process and recipe controls.