Flip Chip Technician

Tata Electronics Limited; India; On-site; INR 900,000 - 1,200,000; Full time

Job summary

Tata Electronics Limited, part of TSAT India, seeks a specialist in the Assembly Technology Development department to drive technology and process development for Flip Chip product packaging. The role focuses on delivering cost-competitive DFM solutions and advancing packaging capabilities within a structured development framework.

The candidate will engage with vendors for data gathering, review initial analyses, and support final decision submissions, contributing to ongoing manufacturing

Job description

Department: Assembly Technology Development

Business: TSAT India

Responsible forthe technology and process development for the Flip Chip product packagingeg

FOL: Back grinding, Laser groove, Mechanical sawing,SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfilland

EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing.

Understand,integrateand innovate to meetcustomers’packagingrequirementsinto a cost competitiveDFMsolution.

Initiateand engage intechnical discussion with vendorsto gatherall relevant data, review and complete theinitialanalysisfor final decisionsubmission.

Involvement in theselectionof4Msbased on latest performance andpreviousexperience/learnings.

Install, buy-offand qualifythe givenprocessesand productsfor development, NPI and LVM.

Continuous Strive for meeting highest degree of packaging difficulty, ease of DFM to meet BEST customer desired outputs, best in class Yield, best Quality in the industry.

Offerwiderange of BOM selection tocater todifferent customerrequirement.

Execution of multiple department projects.

Identifyall process controlsrequirements and usethe BKM forinputs & outputsdata gathering/controls.

Assistin the MES,Automation of material,processand recipe controls.

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