Sr Process And Production Engineer

OSI Optoelectronics; Telangana; On-site; INR 1,800,000 - 2,500,000; Full time

Job summary

OSI Optoelectronics is seeking an experienced professional to lead development and optimization of semiconductor and optoelectronics assembly and packaging processes. The role involves die attach, wire bonding, and encapsulation across diverse substrates, with emphasis on transitioning from development to manufacturing scale.

You will drive NPI transfers, BOM creation, proto typing and FA approvals, while coordinating cost estimates, capacity planning and SPC/yield analysis.

Qualifications

• 10+ years hands-on experience in semiconductor/optoelectronics manufacturing assembly and packaging.
• Programming skills with automatic epoxy machines and optical measurement systems desirable.
• Knowledge of FMEA, Six Sigma and statistical analysis using Minitab.

Responsibilities

• Development of semiconductor/optoelectronics assembly and packaging such as LEDs, hybrid microcircuits, Chip-on-Boards and optoelectronic packages.
• Process development of die attach, wire bonding and encapsulation on various substrates using eutectic, solder, conductive and non-conductive epoxies and transition to manufacturing scale.
• Lead technology/product transfer from sister companies, NPI engineering, BOM creation and maintenance, proto typing and FA approvals.
• Estimate manufacturing costs, equipment capacity, and production ramp-up; provide sustaining process engineering support and train personnel on developed processes, SPC and yield analysis.
• Investigate customer complaints and corrective actions, perform root cause analysis and initiate CAPA with cross-functional teams.

Skills

Die attach

Wire bonding

Encapsulation

FMEA

Six Sigma

Minitab

Mechanical drawings

SolidWorks

AutoCAD

Vision measurement

Tools

SolidWorks

AutoCAD

Job description

Job Description:

Responsibilities

• Development of semiconductor / Optoelectronics assembly & Packaging like LEDs, Hybrid Micro circuits, Chip on boards, optoelectronics packages
• Process development of die attach , wire bonding , encapsulation etc , on various substrates using eutectic , solder , conductive / non conductive epoxies etc and transition to manufacturing scale ;
• To take lead in Technology /Product transfer from sister companies, NPI Engineering , BOM creation and Maintenance, proto typing & FA Approvals
• To workout manufacturing cost estimates , equipment capacity requirements , production ramp up requirements Sustaining process engineering support , training Manufacturing personnel on developed process , SPC and yield analysis.
• Investigate Customer Complaints / corrective action requests , Faiure and route cause analysis and initiate corrective and preventive action measures working with other functional groups

Qualifications

• 10+ years hands on experience in a reputed Semiconductor / Optoelectronics manufacturing plant in assembly and packaging process development of die attach , wire bond and encapsulation .
• Programming skills with automatic epoxy machines, Optical measurement systems desirable.
• Working knowledge of FMEA , Six Sigma and statistical analysis using Minitab etc;
• To interpretate mechanical drawings . Experience preferred to generate drawings in Solid works , Autocad drawings , Programming vision based measurement systems and process equipment.

Requirements