Flip Chip Engineers

Tata Electronics Limited; Assam; On-site; INR 2,400,000 - 3,800,000; Full time

Job summary

Tata Electronics Limited in Assam seeks an Engineer of Flip-Chip Assembly to oversee all flip-chip processes in a semiconductor fabrication facility, manage flip-chip equipment, drive process improvements, and ensure quality targets are met.

You will lead the flip-chip engineering and production team, troubleshoot issues with cross‑functional teams, maintain process records and SOPs, and collaborate on innovations to enhance throughput and reliability.

Qualifications

• Minimum 5 years experience in semiconductor manufacturing.
• Strong analytical and problem‑solving skills.
• Excellent communication and interpersonal skills.
• Demonstrated ability to lead and motivate a diverse team.

Responsibilities

• Oversee flip-chip processes and manage flip-chip equipment to meet targets.
• Lead the flip-chip engineering and production team and coordinate with CFTs.
• Maintain process records, parameters, and inline quality data.
• Develop and update SOPs related to flip-chip processes.
• Collaborate on innovations to improve throughput and reliability.
• Ensure compliance with quality standards and customer specifications.

Skills

Flip-chip leadership

Process optimization

Quality standards

Cross-functional collaboration

Strong communication

Education

Bachelor’s degree in Mechanical, Electronics, or Electrical Engineering

Job description

Department: Assembly Technology Development

Business: TSAT India

As the Engineer of Flip-Chip Assembly, you will be responsible for overseeing and driving all flip-chip processes within a semiconductor manufacturing facility. Your role involves managing flip-chip equipment and operations, implementing process improvements, ensuring robust quality standards, and collaborating with cross-functional teams to meet overall production and yield targets.

Responsibilities:

Extensive experience in flip-chip assembly processes within the semiconductor industry, with a proventrack recordof leadership.

In-depth knowledge of variousflip chipprocess(

Set up andoperateflip-chip bonders and associated assembly tools according to established procedures.

Lead and manage the flip-chip engineering and production team, providing guidance, coaching, and support.

Foster a collaborative and high-performance work environment within the flip-chip department.

Conduct inspections of flip-chip joints, underfill, and overall package reliability to ensure compliance with quality standards and specifications.

Troubleshoot and resolve issues related to flip-chip processes, collaborating with CFT teams to enhance efficiency, quality, and yield.

Maintainaccuraterecords of production activities, including process parameters, equipment settings, and inline quality data.

Contribute to the creation and periodic update of standard operating procedures (SOPs) related to flip-chip processes.

Collaborate with engineering teams to implement improvements and innovations in flip-chip technology, materials, and equipment.

Establish and enforce quality control measures for flip-chip operations.

Ensure compliance with industry standards, reliability requirements, and customer specifications.

Perform routine and preventive maintenance on flip-chip equipment to ensureoptimalperformance.

Develop and implement strategic plans for the flip-chip department in alignment with organizationalobjectives.

Identifyopportunities for cost savings, throughput enhancements, and adoption of advanced packaging technologies.

Collaborate with other department heads, including engineering, production, and quality assurance, to ensure seamless integration of upstream and downstream processes.

Communicate effectively with stakeholders to address challenges andoptimizeworkflows.

Identifyand address skill gaps within the flip-chip team through structured training plans.

Ensure complete andaccuratedocumentation of flip-chip processes, materials, equipment settings, and quality control data.

Drive continuous improvement initiatives through data analysis and cross-functional coordination.

Generate reports on departmental performance, yield trends, and key operational metrics.

Education Qualification:

Minimum 5 years of experience in the semiconductor manufacturing industry.

Bachelor’s degree in Mechanical, Electronics, or Electrical Engineering.

Strong analytical and problem-solving skills.

Excellent communication and interpersonal skills.

Demonstrated ability to lead and motivate a diverse team.