Wirebond Process Engineering Lead

Tata Electronics; Assam; On-site; INR 400,000 - 700,000; Full time

Job summary

Tata Electronics invites applications for the Process Engineering head role to lead end-to-end IC packaging process development, high-volume manufacturing readiness, and continuous improvement across wirebond and flip chip technologies.

You will drive yield, reliability, cost, scalability and technology roadmap execution while aligning with NPI & TD, equipment, quality and customer teams. 15–20 years in semiconductor packaging is preferred.

Qualifications

• Bachelor or Master in Engineering (Mechanical or Electronics preferred).
• Experience in OSAT packaging industry is required.

Responsibilities

• Own end-to-end process integration for wafer/die preparation, die attach, wire bond, underfill and encapsulation.
• Lead technology qualification and scaling from development to high-volume manufacturing.
• Drive cost, yield improvement, reliability and productivity across packaging families.
• Own ramp-up metrics including yield learning curve, cycle time and scrap reduction.
• Mentor engineers and SMEs and build a high-performance process engineering team.
• Serve as technical authority for customers on packaging process topics.

Education

Bachelor / master in related Engineering Discipline (Preferred Mechanical, Electronics)

Job description

Job Description:

Process Engineering head will provide technical and organizational leadership for end-to-end IC packaging process development, high volume manufacturing readiness, and continuous improvement across wirebond and flip chip technologies. The role is accountable for process yield, reliability, cost, scalability and technology roadmap execution, while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams.

Key Responsibilities

Technology & Process Leadership

• Own end-to-end process integration for
  • Wafer /Die Preparation (Wafer thinning, Dicing (Laser, Mechanical), 2nd optical Inspection)
  • Die attach (Direct, Flipchip, Thin die, Epoxy, Film, Sintering)
  • Wire bond (Au, CuPd, Al, Ball Bond, Wedge Bond)
  • Underfill, Plasma clean
  • Taping & 3rd Optical
  • Encapsulation (Transfer Mold, Compression Mold and Lid attach)
  • Plating & Marking
  • Solder ball attach, Reflow and Flux cleaning
    • Package Separation (Cutting, Forming, Singulation) & FV Inspection.
  • Define and maintain process windows, control plans and CTQ across all package families.
  • Lead technology qualification, scaling from development to high volume manufacturing.
  • Drive technology/process roadmaps aligned to customer, market and package needs.

NPI & Manufacturing Readiness

• Lead EVT/ DVT / PVT readiness from a process perspective.
• Partner with NPI, Product Engineering, and TD to ensure DFM and DFR.
• Ensure smooth technology transfer from development to production.
• Own ramp-up metrics: yield learning curve, cycle time, scrap reduction.

Yield, Reliability & Quality Excellence

• Accountable for first pass yield, final yield and field reliability.
• Lead root cause analysis for yield excursions using SPC, FMEA, DOE and failure analysis.
• Own JEDEC reliability qualification of the packages/devices.
• Partner with Quality team to address customer returns, audits and escalations.

Equipment Supplier Management

• Provide technical leadership for process equipment selection, buyoff and productivity improvement.
• Support CAPEX planning and ROI justification.

Cost, Productivity & Operational Excellence

• Own cost of ownership and productivity improvement initiatives.
• Drive OEE, Cycle time and line balancing improvements.
• Lead automation, digitalization and smart manufacturing initiatives.
• Support factory expansion and greenfield/ brownfield setups.

Organization and Talent leadership

• Build and lead high performance process engineering organizations including SMEs.
• Mentor Senior Engineers and SMEs.
  • Define competency frameworks, training roadmaps and succession plans.
  • Foster a culture of technical rigor, accountability, and continuous improvement.
  • Implement and monitor company values.

6. Customer & Stakeholder Engagement

• Serve as a technical authority for customers on packaging process topics.
• Lead customer reviews, technology discussions and risk mitigation plans.
• Support business development with technology feasibility and cost modeling.
• Represent process engineering in executive and customer forums.

Key Deliverables & KPI

• Yield and Reliability Performance.
• Cost reduction and productivity improvement.
• NPI cycle time and ramp success.
• Customer satisfaction and audit outcomes.
• Talent retention and Capability maturity.

Essential Attributes

• Experience in high volume and high package /device mix manufacturing environment.
• Demonstrated success in yield improvement, reliability qualification and cost reduction.

Qualification

• Bachelor / master in related Engineering Discipline (Preferred Mechanical, Electronics).

Desired Experience Level

• 5-7 years’ experience in OSAT industry in a similar role.
• 15-20 years Semiconductor IC Packaging and Assembly.

Requirements: