Flip Chip Engineers

Tata Electronics; Assam; On-site; INR 1,500,000 - 2,100,000; Full time

Job summary

Tata Electronics is seeking an experienced Engineer to oversee flip-chip assembly operations in a semiconductor manufacturing facility. You will lead process execution, equipment setup, and cross-functional collaboration to meet production and yield targets.

Ideal candidates bring 5+ years in semiconductor manufacturing, a relevant bachelor's degree, and strong analytical, communication, and leadership skills to drive continuous improvement and maintain quality standards across the flip-chip

Qualifications

• Minimum 5 years of experience in semiconductors manufacturing.
• Bachelor's degree in Mechanical, Electronics, or Electrical Engineering.
• Strong analytical and problem-solving skills.
• Excellent communication and interpersonal skills.
• Demonstrated ability to lead and motivate a diverse team.

Responsibilities

• Oversee flip-chip assembly processes and drive improvements.
• Set up and operate flip-chip bonders and related tools.
• Lead the flip-chip engineering and production teams.
• Ensure quality, reliability, and yield targets are met.
• Maintain SOPs, process parameters, and production records.
• Collaborate with cross-functional teams to optimize workflows.
• Drive continuous improvement through data analysis.
• Communicate status and performance metrics to stakeholders.

Skills

Analytical skills

Problem solving

Communication skills

Leadership

Education

Bachelor's degree in Mechanical, Electronics, or Electrical Engineering

Job description

Job Description:

As the Engineer of Flip-Chip Assembly, you will be responsible for overseeing and driving all flip-chip processes within a semiconductor manufacturing facility. Your role involves managing flip-chip equipment and operations, implementing process improvements, ensuring robust quality standards, and collaborating with cross-functional teams to meet overall production and yield targets.

Responsibilities:

• Extensive experience in flip-chip assembly processes within the semiconductor industry, with a proventrack recordof leadership.
• In-depth knowledge of variousflip chipprocess(
• Set up andoperateflip-chip bonders and associated assembly tools according to established procedures.
• Lead and manage the flip-chip engineering and production team, providing guidance, coaching, and support.
• Foster a collaborative and high-performance work environment within the flip-chip department.
• Conduct inspections of flip-chip joints, underfill, and overall package reliability to ensure compliance with quality standards and specifications.
• Troubleshoot and resolve issues related to flip-chip processes, collaborating with CFT teams to enhance efficiency, quality, and yield.
• Maintainaccuraterecords of production activities, including process parameters, equipment settings, and inline quality data.
• Contribute to the creation and periodic update of standard operating procedures (SOPs) related to flip-chip processes.
• Collaborate with engineering teams to implement improvements and innovations in flip-chip technology, materials, and equipment.
• Establish and enforce quality control measures for flip-chip operations.
• Ensure compliance with industry standards, reliability requirements, and customer specifications.
• Perform routine and preventive maintenance on flip-chip equipment to ensureoptimalperformance.
• Develop and implement strategic plans for the flip-chip department in alignment with organizationalobjectives.
• Identifyopportunities for cost savings, throughput enhancements, and adoption of advanced packaging technologies.
• Collaborate with other department heads, including engineering, production, and quality assurance, to ensure seamless integration of upstream and downstream processes.
• Communicate effectively with stakeholders to address challenges andoptimizeworkflows.
• Identifyand address skill gaps within the flip-chip team through structured training plans.
• Ensure complete andaccuratedocumentation of flip-chip processes, materials, equipment settings, and quality control data.
• Drive continuous improvement initiatives through data analysis and cross-functional coordination.
• Generate reports on departmental performance, yield trends, and key operational metrics.

Education Qualification:

• Minimum 5 years of experience in the semiconductor manufacturing industry.
• Bachelor's degree in Mechanical, Electronics, or Electrical Engineering.
• Strong analytical and problem-solving skills.
• Excellent communication and interpersonal skills.
• Demonstrated ability to lead and motivate a diverse team.

Requirements: