Sr. Process & Production Engineer

OSI Optoelectronics; Hyderabad; On-site; INR 2,500,000 - 4,000,000; Full time

Job summary

OSI Optoelectronics in Hyderabad, India seeks a senior Process Development Engineer to drive assembly and packaging of optoelectronic devices. You will lead die attach, wire bonding, and encapsulation processes, transitioning designs to manufacturing scale and supporting NPI and FA approvals.

Strong background in Six Sigma, FMEA and SPC is essential. The role also involves techno-transfer from sister companies, BOM maintenance, proto typing, and cost modeling for capex and capacity planning.

Qualifications

• 10+ years hands on experience in a reputed Semiconductor / Optoelectronics manufacturing plant in assembly and packaging process development.
• Programming skills with automatic epoxy machines, optical measurement systems desirable.
• Working knowledge of FMEA, Six Sigma and statistical analysis using Minitab.
• Ability to interpret mechanical drawings; experience generating drawings in SolidWorks / AutoCAD and programming vision-based measurement systems.

Responsibilities

• Development of semiconductor / Optoelectronics assembly & Packaging like LEDs, Hybrid Micro circuits, Chip on boards, optoelectronics packages
• Process development of die attach, wire bonding, encapsulation on various substrates using eutectic, solder, conductive/non-conductive epoxies and transition to manufacturing scale
• Lead Technology/Product transfer from sister companies, NPI Engineering, BOM creation and maintenance, prototyping & FA Approvals
• Work out manufacturing cost estimates, equipment capacity requirements, production ramp up requirements; sustaining process engineering support, training manufacturing personnel on developed process, SPC and yield analysis
• Investigate Customer Complaints / corrective action requests, Failure and root cause analysis and initiate CAPA with cross-functional teams

Job description

• Development of semiconductor / Optoelectronics assembly & Packaging like LEDs, Hybrid Micro circuits, Chip on boards, optoelectronics packages


• Process development of die attach , wire bonding , encapsulation etc , on various substrates using eutectic , solder , conductive / non conductive epoxies etc and transition to manufacturing scale ;


• To take lead in Technology /Product transfer from sister companies, NPI Engineering , BOM creation and Maintenance, proto typing & FA Approvals


• To workout manufacturing cost estimates , equipment capacity requirements , production ramp up requirements Sustaining process engineering support , training Manufacturing personnel on developed process , SPC and yield analysis.


• Investigate Customer Complaints / corrective action requests , Faiure and route cause analysis and initiate corrective and preventive action measures working with other functional groups

Responsibilities

• Development of semiconductor / Optoelectronics assembly & Packaging like LEDs, Hybrid Micro circuits, Chip on boards, optoelectronics packages


• Process development of die attach , wire bonding , encapsulation etc , on various substrates using eutectic , solder , conductive / non conductive epoxies etc and transition to manufacturing scale ;


• To take lead in Technology /Product transfer from sister companies, NPI Engineering , BOM creation and Maintenance, proto typing & FA Approvals


• To workout manufacturing cost estimates , equipment capacity requirements , production ramp up requirements Sustaining process engineering support , training Manufacturing personnel on developed process , SPC and yield analysis.


• Investigate Customer Complaints / corrective action requests , Faiure and route cause analysis and initiate corrective and preventive action measures working with other functional groups

Qualifications

• 10+ years hands on experience in a reputed Semiconductor / Optoelectronics manufacturing plant in assembly and packaging process development of die attach , wire bond and encapsulation .


• Programming skills with automatic epoxy machines, Optical measurement systems desirable.


• Working knowledge of FMEA , Six Sigma and statistical analysis using Minitab etc;


• To interpretate mechanical drawings . Experience preferred to generate drawings in Solid works , Autocad drawings , Programming vision based measurement systems and process equipment.