Flip Chip Technician

Tata Electronics Limited; Assam; On-site; INR 900,000 - 1,500,000; Full time

Job summary

Tata Electronics Limited is seeking a packaging technology and process development professional in India’s Assam region. The role leads a team focused on Flip Chip packaging, drive process development across front-end and back-end steps, and aims for cost‑effective DFM solutions while delivering high quality outputs.

The incumbent will coordinate with vendors, oversee 4Ms selection, and drive continuous improvement in yield and process control across multiple projects.

Qualifications

• Experience in leading a group or team of employees in achieving organizational goals.
• Exposure in MS Office, 8D writing, DOE, SPC, FMEA, OCAP and Control Plan.
• Passionate about achieving what’s not possible via innovation and continuous learning.

Responsibilities

• Responsible for the technology and process development for Flip Chip product packaging.
• FOL: Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill and other processes.
• EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing.
• Understand, integrate, and innovate to meet customers’ packaging requirements into a cost‑competitive DFM solution.
• Initiate and engage in technical discussions with vendors to gather all relevant data, review and complete the initial analysis for final decision submission.
• Involve in selection of 4Ms based on latest performance and previous experience/learnings.
• Install, buy‑off and qualify the given processes and products for development, NPI and LVM.
• Continuous strive for meeting highest degree of packaging difficulty, ease of DFM to meet best customer desired outputs, best in class yield, best quality in the industry.
• Offer a wide range of BOM selection to cater to different customer requirements.
• Execute multiple department projects.
• Identify all process controls requirements and use the BKM for inputs & outputs data gathering/controls.
• Assist in the MES, automation of material, process and recipe controls.

Skills

Leadership

8D writing

DOE

SPC

FMEA

OCAP

Control Plan

MS Office

Job description

Responsibilities

• Responsible for the technology and process development for Flip Chip product packaging.
• FOL: Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill and other processes.
• EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing.
• Understand, integrate, and innovate to meet customers’ packaging requirements into a cost‑competitive DFM solution.
• Initiate and engage in technical discussions with vendors to gather all relevant data, review and complete the initial analysis for final decision submission.
• Involve in selection of 4Ms based on latest performance and previous experience/learnings.
• Install, buy‑off and qualify the given processes and products for development, NPI and LVM.
• Continuous strive for meeting highest degree of packaging difficulty, ease of DFM to meet best customer desired outputs, best in class yield, best quality in the industry.
• Offer a wide range of BOM selection to cater to different customer requirements.
• Execute multiple department projects.
• Identify all process controls requirements and use the BKM for inputs & outputs data gathering/controls.
• Assist in the MES, automation of material, process and recipe controls.

Qualifications

• Experience in leading a group or team of employees in achieving organizational goals.
• Exposure in MS Office, 8D writing, DOE, SPC, FMEA, OCAP and Control Plan.
• Passionate about achieving what’s not possible via innovation and continuous learning.