VP Principal Software Engineer, Securities Lending Lead

Morgan Stanley Asia Limited

Hong Kong

On-site

HKD 1,000,000 - 2,000,000

Full time

8 days ago
Application generator

An application made for this job — a tailored resume and cover letter that speak straight to the posting.

Get past ATS filters

Job summary

Morgan Stanley is seeking a Vice President, Principal Software Engineer (Securities Lending) to lead development within the Asia Securities Lending Technology team. The role combines hands-on Java/Scala coding with architectural leadership and close collaboration with the trading desk to deliver scalable solutions.

The candidate will own the SDLC for major deliverables, mentor peers, and drive innovative architectures, both on-premises and in public cloud environments, within a dynamic, global

Qualifications

  • At least 12 years of relevant software development experience.
  • Hands-on development in Java/Scala and strong algorithmic/data structures background.
  • Experience collaborating with trading desks to gather requirements and architect solutions.
  • Familiarity with Agile methodologies and cloud/on-premises architectures.

Responsibilities

  • Own full SDLC for assigned deliverables from requirements to deployment.
  • Develop and lead software solutions for Securities Lending operations.
  • Collaborate with the front office trading desk and stakeholders to drive architecture.
  • Mentor junior staff and lead project initiatives.

Skills

Java/Scala
Agile methodologies
Relational databases/SQL
Front office trading experience
Stakeholder communication
Leadership/mentoring

Job description

Morgan Stanley is seeking a Vice President, Principal Software Engineer (Securities Lending) to lead development within the Asia Securities Lending Technology team. The role combines hands-on Java/Scala coding with architectural leadership and close collaboration with the trading desk to deliver scalable solutions.

The candidate will own the SDLC for major deliverables, mentor peers, and drive innovative architectures, both on-premises and in public cloud environments, within a dynamic, global

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

VP Lead Engineer, Securities Lending Tech
VP Lead Engineer, Securities Lending Tech

PowerToFly • Hong Kong

On-site
HKD 900,000 - 1,500,000
Vice President, Principal Software Engineer (Securities Lending)
Vice President, Principal Software Engineer (Securities Lending)

Morgan Stanley Asia Limited • Hong Kong

On-site
HKD 1,000,000 - 2,000,000
Vice President, Principal Software Engineer (Securities Lending)
Vice President, Principal Software Engineer (Securities Lending)

PowerToFly • Hong Kong

On-site
HKD 900,000 - 1,500,000
Senior Engineer, Securities Lending Platform
Senior Engineer, Securities Lending Platform

Morgan Stanley • Hong Kong

On-site
HKD 600,000 - 900,000
Senior Platform Engineer – Securities Lending
Senior Platform Engineer – Securities Lending

Morgan Stanley Asia Limited • Hong Kong

On-site
HKD 1,000,000 - 1,800,000
Senior Full-Stack Tech Lead – Java/Scala
Senior Full-Stack Tech Lead – Java/Scala

Morgan Stanley Asia Limited • Hong Kong

On-site
HKD 900,000 - 1,500,000
Senior Full-Stack Engineer (Java/Scala, Angular)
Senior Full-Stack Engineer (Java/Scala, Angular)

Morgan Stanley • Hong Kong

On-site
HKD 900,000 - 1,200,000
Lead Engineer, Securities Lending Platform
Lead Engineer, Securities Lending Platform

PowerToFly • Hong Kong

On-site
HKD 1,000,000 - 1,500,000
Lead Engineer - Securities Lending
Lead Engineer - Securities Lending

Morgan Stanley Asia Limited • Hong Kong

On-site
HKD 1,000,000 - 1,800,000
Senior VP Software Engineer - Global FXEM & Rates Platform
Senior VP Software Engineer - Global FXEM & Rates Platform

Morgan Stanley Asia Limited • Hong Kong

On-site
HKD 1,200,000 - 1,800,000