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A leading client in Oxford is seeking a Principal Semiconductor Packaging Engineer in Brighton to steer the packaging roadmap for quantum processor devices. The role encompasses development of packaging methods focused on thermal performance and collaboration with suppliers. Ideal candidates will possess experience in semiconductor packaging and strong communication skills.
IC Resources
brighton, United Kingdom
Other
-
Yes
2
04.06.2025
19.07.2025
Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
Please contact Rachel Anderson for further details.
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Created on 04/06/2025 by JR United Kingdom