Principal Semiconductor Packaging Engineer

JR United Kingdom; Peterborough; On-site; GBP 50,000 - 70,000; Full time

Job summary

A leading client based in Oxford is seeking a Principal Semiconductor Packaging Engineer to develop and produce packaging methods for quantum processor devices. Responsibilities will include steering the packaging roadmap, working with external partners, and designing failure analysis experiments. Ideal candidates will have extensive experience in semiconductor packaging processes and excellent communication skills.

Qualifications

• Experience with semiconductor/photonic packaging methods is crucial.
• Strong knowledge of die bonding methods for thermal performance required.
• Experience collaborating with 3rd party suppliers is essential.

Responsibilities

• Steer the packaging roadmap for quantum processor devices.
• Develop wirebond and bumping methods for effective packaging.
• Supervise failure analysis experiments.

Skills

Semiconductor/photonic packaging methods

Knowledge of package substrate technologies

Die bonding methods

Internal and external communication skills

Job description

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Principal Semiconductor Packaging Engineer, peterborough

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Client:

IC Resources

Location:

peterborough, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.