Principal Semiconductor Packaging Engineer

JR United Kingdom; Leicester; On-site; GBP 50,000 - 70,000; Full time

Job summary

A leading-edge Oxford-based client is seeking a Principal Packaging Engineer to lead the packaging roadmap of quantum processor devices. The role involves developing innovative packaging methods and supervising failure analysis experiments. Ideal candidates will have experience in semiconductor and photonic packaging with strong communication skills.

Qualifications

• Experience of semiconductor/photonic packaging methods.
• Knowledge of die bonding methods for good thermal and mechanical performance.
• Experience working with 3rd party suppliers.

Responsibilities

• Steer the packaging roadmap for quantum processor devices.
• Develop wirebond and bumping methods, and photonics packaging methods.
• Design and supervise failure analysis experiments.

Skills

Semiconductor/photonic packaging methods

Package substrate technologies

Die bonding methods

Internal and external communication

Job description

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.