Principal Semiconductor Packaging Engineer

JR United Kingdom; Cambridge; On-site; GBP 50,000 - 75,000; Full time

Job summary

A leading-edge client in Oxford is seeking a Principal Packaging Engineer to guide the packaging roadmap for quantum processor devices. This role involves developing wirebond and bumping methods, as well as thermal performance packaging. Candidates should possess experience in semiconductor and photonics packaging methods, and strong communication skills are essential.

Qualifications

• Experience in semiconductor and photonic packaging methods.
• Knowledge of die bonding methods for thermal and mechanical performance.
• Experience with third party suppliers.

Responsibilities

• Steer the packaging roadmap for quantum processor devices.
• Develop packaging methods for thermal performance.
• Design and supervise failure analysis experiments.

Skills

Semiconductor packaging methods

Photonics packaging methods

Die bonding methods

Communication skills

Job description

Our leading-edge Oxford-based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.

The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies, and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.