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A leading company is seeking a Principal Semiconductor Packaging Engineer in Nottingham to develop and produce advanced quantum processor packaging methods. The role requires strong communication and a deep understanding of semiconductor and photonic packaging techniques. Candidates will oversee project direction and collaborate with various suppliers and teams.
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IC Resources
nottingham, United Kingdom
Other
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Yes
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2
04.06.2025
19.07.2025
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Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
Please contact Rachel Anderson for further details.